PCF8577CP NXP Semiconductors, PCF8577CP Datasheet - Page 19

• Manufacturer Part Number: PCF8577CP
• Manufacturer: NXP Semiconductors

Specifications of PCF8577CP

• Operating Supply Voltage (typ): 3.3/5V
• Number Of Segments: 64
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Package Type: PDIP
• Pin Count: 40
• Mounting: Through Hole
• Power Dissipation: 500mW
• Frequency (max): 100KHz
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 6V
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
13 CHIP DIMENSIONS AND BONDING PAD LOCATIONS
1998 Jul 30
handbook, full pagewidth
LCD direct/duplex driver with
I
Chip area = 4.62 mm
Thickness = 381 25 m.
n-substrate (back) connected to V
Bonding pad dimensions = 110 m
2
C-bus interface
2
.
DD
2.31
.
mm
110 m.
handbook, halfpage
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
10
12
13
14
15
16
11
5
6
7
8
9
Fig.18 Bonding pad locations.
17
Fig.19 Reference marks.
4
18
3
x
19
2
PCF8577C
0
20
2 mm
1
y
0
19
40
21
39
22
38
23
MBE924
37
24
MGA726
36
35
34
33
32
31
30
29
28
27
26
25
V DD
A2/BP2
BP1
S1
S2
S3
S4
S5
S6
S7
Product specification
PCF8577C