74LVC16245ADGG NXP Semiconductors, 74LVC16245ADGG Datasheet - Page 2

• Manufacturer Part Number: 74LVC16245ADGG
• Manufacturer: NXP Semiconductors

Specifications of 74LVC16245ADGG

• Logic Family: LVC
• Operating Supply Voltage (typ): 1.8/2.5/3.3V
• Propagation Delay Time: 8.5ns
• Number Of Elements: 2
• Number Of Channels: 16
• Input Logic Level: LVTTL
• Output Logic Level: LVTTL
• Output Type: 3-State
• Package Type: TSSOP
• Polarity: Non-Inverting
• Logical Function: Bus Transceiver
• Operating Supply Voltage (min): 1.2V
• Operating Supply Voltage (max): 3.6V
• Quiescent Current (typ): 100nA
• Technology: CMOS
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
3. Ordering information
Table 1.
4. Functional diagram
74LVC_LVCH16245A_9
Product data sheet
Type number
74LVC16245ADL
74LVCH16245ADL
74LVC16245ADGG
74LVCH16245ADGG
74LVC16245AEV
74LVCH16245AEV
74LVC16245ABQ
74LVCH16245ABQ
Fig 1.
Logic symbol
Ordering information
1DIR
Temperature range Package
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
1A0
1A1
1A2
1A3
1A4
1A5
1A6
1A7
All information provided in this document is subject to legal disclaimers.
Name
SSOP48
TSSOP48
VFBGA56
HXQFN60U plastic thermal enhanced extremely thin quad flat
Rev. 09 — 29 March 2010
74LVC16245A; 74LVCH16245A
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
1B0
1B1
1B2
1B3
1B4
1B5
1B6
1B7
1OE
plastic shrink small outline package; 48 leads;
Description
body width 7.5 mm
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
plastic very thin fine-pitch ball grid array package;
56 balls; body 4.5 × 7 × 0.65 mm
package; no leads; 60 terminals; UTLP based;
body 4 x 6 x 0.5 mm
2DIR
2A0
2A1
2A2
2A3
2A4
2A5
2A6
2A7
001aaa789
2OE
2B0
2B1
2B2
2B3
2B4
2B5
2B6
2B7
© NXP B.V. 2010. All rights reserved.
Version
SOT370-1
SOT362-1
SOT702-1
SOT1134-1
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