RC28F128J3C150 Intel, RC28F128J3C150 Datasheet - Page 11

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RC28F128J3C150

Manufacturer Part Number
RC28F128J3C150
Description
Manufacturer
Intel
Datasheet

Specifications of RC28F128J3C150

Cell Type
NOR
Density
128Mb
Access Time (max)
150ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
24/23Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
EZBGA
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
16M/8M
Mounting
Surface Mount
Pin Count
64
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
RC28F128J3C150
Manufacturer:
INTEL
Quantity:
576
Part Number:
RC28F128J3C150SL756
Manufacturer:
Intel
Quantity:
10 000
3.0
3.1
Datasheet
Package Height
Standoff
Package Body Thickness
Lead Width
Lead Thickness
Package Body Length
Package Body Width
Lead Pitch
Terminal Dimension
Lead Tip Length
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Figure 3. 56-Lead TSOP Package Drawing and Specifications
Table 1. 56-Lead TSOP Dimension Table
Package Information
56-Lead TSOP Package
Pin 1
Z
Detail A
Sym
D
A
A
A
E
D
N
Y
b
c
e
L
Z
1
2
1
See Detail A
See Notes 1 and 3
18.200
13.800
19.800
0.050
0.965
0.100
0.100
0.500
0.150
Min
L
D
D
1
C
18.400
14.000
0
0.995
0.150
0.150
0.500
20.00
0.600
0.250
Nom
56
Millimeters
See Note 2
18.600
14.200
20.200
1.200
1.025
0.200
0.200
0.700
0.100
0.350
b
Max
Detail B
A
E
Notes
4
4
A
2
0.002
0.038
0.004
0.004
0.717
0.543
0.780
0.020
0.006
Min
Seating
Plane
A
See Detail B
e
1
Y
0.0197
0.039
0.006
0.006
0.724
0.551
0.787
0.024
0.010
Nom
56
256-Mbit J3 (x8/x16)
Inches
0.047
0.040
0.008
0.008
0.732
0.559
0.795
0.028
0.004
0.014
Max
Notes
4
4
11

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