RC28F128J3C150 Intel, RC28F128J3C150 Datasheet - Page 24

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RC28F128J3C150

Manufacturer Part Number
RC28F128J3C150
Description
Manufacturer
Intel
Datasheet

Specifications of RC28F128J3C150

Cell Type
NOR
Density
128Mb
Access Time (max)
150ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
24/23Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
EZBGA
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
16M/8M
Mounting
Surface Mount
Pin Count
64
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
RC28F128J3C150
Manufacturer:
INTEL
Quantity:
576
Part Number:
RC28F128J3C150SL756
Manufacturer:
Intel
Quantity:
10 000
256-Mbit J3 (x8/x16)
24
A[MAX:3] [A]
D[15:0] [Q]
A[2:1] [A]
WE# [W]
Figure 10. 4-Word Page Mode Read Waveform
OE# [G]
RP# [P]
CEx [E]
NOTES:
NOTE: CE
1. CE
2. When reading the flash array a faster t
first edge of CE0, CE1, or CE2 that disables the device (see
Register reads, query reads, or device identifier reads).
X
low is defined as the last edge of CE0, CE1, or CE2 that enables the device. CE
the first edge of CE0, CE1, or CE2 that disables the device (see
X
low is defined as the last edge of CE0, CE1, or CE2 that enables the device. CE
R6
R5
R7
R2
R3
R4
00
1
GLQV
(R16) applies. For non-array reads, R4 applies (i.e.: Status
R10
R1
R1
R15
01
2
Table
13).
10
Table
3
13).
X
11
high is defined at the
4
X
high is defined at
R10
Datasheet
R9
R8
0606_16

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