RC28F256P30B85 Micron Technology Inc, RC28F256P30B85 Datasheet - Page 94

• Manufacturer Part Number: RC28F256P30B85
• Manufacturer: Micron Technology Inc

Specifications of RC28F256P30B85

• Cell Type: NOR
• Density: 256Mb
• Access Time (max): 85/17ns
• Interface Type: Parallel/Serial
• Boot Type: Bottom
• Address Bus: 24b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: EZBGA
• Program/erase Volt (typ): 1.7 to 2/8.5 to 9.5V
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 2V
• Word Size: 16b
• Number Of Words: 16M
• Supply Current: 28mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / Rohs Status: Not Compliant

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Datasheet
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The "current state" is that of the "chip" and not of the "partition"; Each partition "remembers" which output (Array, ID/CFI
or Status) it was last pointed to on the last instruction to the "chip", but the next state of the chip does not depend on
where the partition's output mux is presently pointing to.
Confirm commands (Lock Block, Unlock Block, Lock-Down Block, Configuration Register) perform the operation and then
move to the Ready State.
WA0 refers to the block address latched during the first write cycle of the current operation.
August 2008
306666-12
P30