LM4835MTX National Semiconductor, LM4835MTX Datasheet - Page 24
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LM4835MTX
Manufacturer Part Number
LM4835MTX
Description
Manufacturer
National Semiconductor
Datasheet
1.LM4835MTX.pdf
(28 pages)
Specifications of LM4835MTX
Operational Class
Class-AB
Audio Amplifier Output Configuration
2-Channel Stereo
Output Power (typ)
1.5W
Audio Amplifier Function
Headphone/Speaker
Total Harmonic Distortion
0.3@8Ohm@1W%
Single Supply Voltage (typ)
3/5V
Dual Supply Voltage (typ)
Not RequiredV
Power Supply Requirement
Single
Rail/rail I/o Type
No
Power Supply Rejection Ratio
74dB
Single Supply Voltage (min)
2.7V
Single Supply Voltage (max)
5.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
28
Package Type
TSSOP
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LM4835MTX
Manufacturer:
ERICSSON
Quantity:
5
Part Number:
LM4835MTX
Manufacturer:
NS/国半
Quantity:
20 000
Company:
Part Number:
LM4835MTX/NOPB
Manufacturer:
NS
Quantity:
13 929
Part Number:
LM4835MTX/NOPB
Manufacturer:
NS/国半
Quantity:
20 000
www.national.com
LM4835 MDC MWC
Stereo 2W Audio Power Amplifier with DC Volume Control and Selectable
Gain
DIE/WAFER CHARACTERISTICS
SIGNAL NAME
Right Out +
GND
SHUT DOWN
Gain Select
Mode
Mute
VDD
DC Vol
GND
Right Dock
Right In
Beep In
Left In
Left Dock
Physical Die Identification
Die Step
Wafer Diameter
Dise Size (Drawn)
Thickness
Min Pitch
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
PAD# NUMBER
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
Fabrication Attributes
Physical Attributes
10
11
12
13
14
1
2
3
4
5
6
7
8
9
Die Bond Pad Coordinate Locations (A - Step)
-1162
-1162
-1162
-1162
-1162
-1162
-1162
-1162
-245
-505
-791
-936
-936
-791
LM4835A
A
150mm
2578µm x 2438µm
101.5mils x
96.0mils
254µm Nominal
145µm Nominal
X/Y COORDINATES
X
Die Layout (A - Step)
24
-1093
-1093
1093
1093
1093
1093
-186
-385
-618
-850
835
690
340
101
Y
Bond Pad Opening Size
(min)
Bond Pad Metalization
Passivation
Back Side Metal
Back Side Connection
10013983
212
212
104
104
104
104
104
104
104
104
104
104
104
104
General Die Information
X
PAD SIZE
104µm x 104µm
ALUMINUM
NITRIDE OVER
PASSIVATION OXIDE
BARE BACK
Floating
x
x
x
x
x
x
x
x
x
x
x
x
x
x
104
104
104
104
104
104
104
104
212
104
104
104
104
104
Y