PPC440GX-3NF533C Applied Micro Circuits Corporation, PPC440GX-3NF533C Datasheet - Page 58

• Manufacturer Part Number: PPC440GX-3NF533C
• Manufacturer: Applied Micro Circuits Corporation

Specifications of PPC440GX-3NF533C

• Family Name: 440GX
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 533MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5/2.5V
• Operating Supply Voltage (max): 1.6/2.7V
• Operating Supply Voltage (min): 1.4/2.3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 552
• Package Type: FCBGA
• Lead Free Status / Rohs Status: Compliant

440GX – Power PC 440GX Embedded Processor
58
Package Thermal Specifications
Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:
Junction-to-case thermal resistance
Case-to-ambient thermal resistance (w/o heat
sink)
Junction-to-ball (typical)
Notes:
1. Case temperature, T
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately predict
3. Modeled on standard JEDEC 2S2P card, 50x50mm
4. 1.5 °C/W is the theoretical
thermal performance in production equipment environments. The operational case temperature must be maintained.
using 1oz. copper power planes, with an effective heat transfer area of 75mm
Parameter
C
, is measured at top center of case surface with device soldered to circuit board.
θ
JB
using an infinite heat sink. The larger number applies to the module mounted on a 1.8mm thick, 2P card
Symbol
θ
θ
θ
CA
JC
JB
Ceramic
Plastic
Ceramic
Plastic
Ceramic
Plastic
Package
0 (0)
<0.1
18.9
2
Min
1.2
1.5
.
ft/min (m/sec)
100 (0.51)
Airflow
Range
Nom
<0.1
17.7
20.8
1.2
8.2
Revision 1.20 – June 9, 2009
200 (1.02)
<0.1
16.3
Max
1.2
2.2
Data Sheet
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1, 3
2, 3
AMCC
1
2
4