A42MX24-PQ208 MICROSEMI, A42MX24-PQ208 Datasheet - Page 28

• Manufacturer Part Number: A42MX24-PQ208
• Manufacturer: MICROSEMI

Specifications of A42MX24-PQ208

• Family Name: 42MX
• Number Of Usable Gates: 36000
• Number Of Logic Blocks/elements: 912
• # Registers: 1410
• # I/os (max): 176
• Process Technology: 0.45um (CMOS)
• Operating Supply Voltage (typ): 3.3/5V
• Logic Cells: 912
• Device System Gates: 36000
• Propagation Delay Time: 2.5/1.8ns
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 5.25V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 208
• Package Type: PQFP
• Lead Free Status / Rohs Status: Not Compliant

Junction Temperature (T
The temperature variable in the Designer software refers
to
temperature. This is an important distinction because the
heat generated from dynamic power consumption is
usually hotter than the ambient temperature.
shown below, can be used to calculate junction
temperature.
Where:
T
ΔT = Temperature gradient between junction (silicon)
and ambient
ΔT =
The maximum power dissipation for military-grade devices is a function of
maximum power dissipation allowed for CQFP 208-pin package at military temperature and still air is as follows:
Table 21 •
1 -2 2
Plastic Packages
Plastic Quad Flat Pack
Plastic Quad Flat Pack
Plastic Quad Flat Pack
Plastic Quad Flat Pack
Plastic Leaded Chip Carrier
Plastic Leaded Chip Carrier
Plastic Leaded Chip Carrier
Thin Plastic Quad Flat Pack
Very Thin Plastic Quad Flat Pack
Very Thin Plastic Quad Flat Pack
Plastic Ball Grid Array
Ceramic Packages
Ceramic Quad Flat Pack
Ceramic Quad Flat Pack
a
40MX and 42MX FPGA Families
= Ambient Temperature
the
θ
ja
* P(2)
Junction Temperature = ΔT + T
junction
Maximum Power Allowed
Maximum Power Allowed
Package Thermal Characteristics
temperature,
=
=
Max. junction temp. (°C) Max. ambient temp. (°C)
---------------------------------------------------------------------------------------------------------------------------------
Max. junction temp. (°C) Max. ambient temp. (°C)
---------------------------------------------------------------------------------------------------------------------------------
not
J
)
the
Pin Count
a
(1)
100
160
208
240
176
100
272
208
256
44
68
84
80
ambient
EQ
EQ 1-1
θ
1-1,
θ
jc
ja
(°C/W)
(°C/W)
v6.1
–
–
12.0
10.0
16.0
13.0
12.0
11.0
12.0
10.0
8.0
8.5
3.0
2.0
2.0
θ
jc
P = Power
θ
located in the Package Thermal Characteristics table
below.
Package Thermal Characteristics
The device junction-to-case thermal characteristic is θ
and the junction-to-ambient air characteristic is θ
thermal characteristics for θ
different air flow rates.
The maximum junction temperature is 150°C.
Maximum power dissipation for commercial- and
industrial-grade devices is a function of
A sample calculation of the absolute maximum power
dissipation allowed for a TQFP 176-pin package at
commercial temperature and still air is as follow:
ja
= Junction to ambient of package.
Still Air
27.8
26.2
26.1
25.6
20.0
25.0
22.5
24.7
38.2
35.3
18.3
22.0
20.0
θ
jc
. A sample calculation of the absolute
=
=
200 ft/min.
150°C 125°C
------------------------------------- -
1.0 m/s
150°C 70°C
---------------------------------- -
23.4
22.8
22.5
22.3
24.5
21.0
18.9
19.9
31.9
29.4
14.9
19.8
16.5
θ
6.3°C/W
28°C/W
ja
–
–
ja
500 ft/min.
are shown with two
2.5 m/s
=
=
21.2
21.1
20.8
20.8
22.0
19.4
17.6
18.0
29.4
27.1
13.9
18.0
15.0
2.86W
3.97W
θ
θ
ja
ja
.
numbers are
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
ja
. The
jc
,