HPMD7904TR1 Avago Technologies US Inc., HPMD7904TR1 Datasheet - Page 9

• Manufacturer Part Number: HPMD7904TR1
• Manufacturer: Avago Technologies US Inc.

Specifications of HPMD7904TR1

• Pin Count: 3
• Screening Level: Commercial
• Lead Free Status / Rohs Status: Not Compliant

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It is the nature of PBC (printed circuit board) prod-
ucts that there is some warp in them, especially in
the long dimension. The FBAR duplexer will exhibit
a small amount of lifting on the two narrow faces
(where the Tx and Rx pads are located) when it is
placed upon a flat surface. See the illustration above.
In order to achieve data sheet performance, the Tx
pad and two ground connections on each side, as well
as the Rx pad with two ground connections on each
Figure 21. Duplexer solder paste pattern.
Figure 22. Duplexer solder stencil dimensions.
side, must be soldered to mating lands on the
motherboard. Thus it is necessary to screen down a
pattern of solder paste that will allow the center of
the duplexer to be closer to the motherboard, bring-
ing the Tx and Rx contacts down to their solder paste
pads. See Figures 21, 22 and 23. These stripes pro-
vide approximately 50% coverage—that is, 50% of the
ground pad is covered with solder paste. This is
equivalent to laying down a continuous layer of sol-
der paste at half the thickness of the in/out pads and
their ground pads.
Solder Materials
The recommended solder profile for the FBAR
duplexer is shown in Figure 24. Guidelines are given
in red, and a typical profile is shown in blue. This
typical profile was tested on ten
samples of the duplexer, each of
which was subjected to the profile
six times without effect upon the
mechanical or electrical characteris-
tics of the device. Solder tempera-
tures and times in excess of those
given in the guidelines of Table 1 may
result in damage to the duplexer or
changes in its characteristics.