BGA2022T NXP Semiconductors, BGA2022T Datasheet - Page 3

• Manufacturer Part Number: BGA2022T
• Manufacturer: NXP Semiconductors

Specifications of BGA2022T

• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. LO and RF signals always AC coupled; 50
2. T
THERMAL CHARACTERISTICS
CHARACTERISTICS
V
2000 Dec 04
V
I
P
P
P
T
T
R
I
G
NF
IP
VSWR
S
S
S
SYMBOL
SYMBOL
SYMBOL
stg
j
S
LO
RF
tot
th j-s
MMIC mixer
conv(p)
3
= 2.8 V; I
s
is the temperature at the soldering point of the ground tab.
LO
S
= 6 mA; T
supply voltage
supply current
oscillator power
RF power
total power dissipation
storage temperature
junction temperature
thermal resistance from junction to solder point
supply current
power conversion gain
noise figure
intercept point third order input
return losses at LO port
880 MHz
1800 MHz
1950 MHz
2450 MHz
880 MHz
1800 MHz
1950 MHz
2450 MHz
880 MHz
1800 MHz
1950 MHz
2450 MHz
j
= 25 C; unless otherwise specified.
PARAMETER
PARAMETER
PARAMETER
source; no external DC voltage supplied to pins 1, 2 and 6.
note 1
note 1
T
V
P
DSB
output referred
P
s
S
RF
LO
= 2.8 V
= 25 dBm; P
= 0 dBm; f = 0 to 3 GHz
100 C; note 2
3
CONDITIONS
CONDITIONS
LO
= 0 dBm
4
4
MIN.
65
MIN.
VALUE
375
6
5
6
5
6
9
12
9
9
4
7
7
10
TYP.
4
10
10
10
40
+150
150
Product specification
MAX.
BGA2022
8
8
2:1
MAX.
UNIT
K/W
V
mA
dBm
dBm
mW
C
C
UNIT
mA
dB
dB
dB
dB
dB
dB
dB
dB
dBm
dBm
dBm
dBm
UNIT