GT28F160C3TA90 Intel, GT28F160C3TA90 Datasheet - Page 65
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GT28F160C3TA90
Manufacturer Part Number
GT28F160C3TA90
Description
Flash Mem Parallel 3V/3.3V 16M-Bit 1M x 16 90ns 48-Pin UBGA
Manufacturer
Intel
Datasheet
1.GT28F160C3TA90.pdf
(68 pages)
Specifications of GT28F160C3TA90
Package
48UBGA
Density
16 Mb
Architecture
Sectored
Block Organization
Asymmetrical
Location Of Boot Block
Top
Typical Operating Supply Voltage
3|3.3 V
Sector Size
8KByte x 8|64KByte x 31
Support Of Common Flash Interface
Yes
Timing Type
Asynchronous
Operating Temperature
-40 to 85 °C
Interface Type
Parallel
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GT28F160C3TA90
Manufacturer:
OSRAM
Quantity:
5 634
Datasheet
Figure 20. TSOP Package Drawing & Dimensions
Dimensions
1. One dimple on package denotes Pin 1.
2. If two dimples, then the larger dimple denotes Pin 1.
3. Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
4. Pin 1 will always supersede above pin one notes.
Seating Plane Coplanarity
Package Body Thickness
Lead to Package Offset
Package Body Width
Pin 1
Terminal Dimension
Plastic Body Length
Lead Tip Length
Package Height
Lead Thickness
Lead Tip Angle
Lead Count
Lead Width
Lead Pitch
Standoff
Z
b
Detail B
See Detail A
See Notes 1, 2, 3 and 4
Symbol
D1
A1
A2
A
E
D
N
Ø
Y
Z
b
c
e
L
Family: Thin Small Out -Line Package
18.200 18.400 18.600
11.800 12.000 12.200
19.800 20.000 20.200
D
0.050
0.950
0.150
0.100
0.500
0.150
D
Min
1
0°
Millimeters
1.000
0.200
0.150
0.500
0.600
0.250
Nom
48
3°
Intel
1.200
1.050
0.300
0.200
0.700
0.100
0.350
Detail A
Max
5°
£
Advanced+ Boot Block Flash Memory (C3)
Notes
A
L
E
0.002
0.037
0.006
0.004
0.717
0.465
0.780
0.020
0.006
Min
0°
C
A
2
0
Inches
0.0197
0.039
0.008
0.006
0.724
0.472
0.787
0.024
0.010
Nom
48
3°
0.047
0.041
0.012
0.008
0.732
0.480
0.795
0.028
0.004
0.014
Seating
Plane
Max
A
5°
e
1
See Detail B
Notes
Y
A5568-02
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