MT4C4M4A1TG-5 Micron Technology Inc, MT4C4M4A1TG-5 Datasheet

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MT4C4M4A1TG-5

Manufacturer Part Number
MT4C4M4A1TG-5
Description
DRAM Chip FPM 16M-Bit 4Mx4 5V 24-Pin TSOP Tray
Manufacturer
Micron Technology Inc
Type
FPMr
Datasheet

Specifications of MT4C4M4A1TG-5

Package
24TSOP
Density
16 Mb
Address Bus Width
12 Bit
Operating Supply Voltage
5 V
Maximum Random Access Time
50 ns
Operating Temperature
0 to 70 °C
DRAM
FEATURES
• Industry-standard x4 pinout, timing, functions,
• High-performance, low-power CMOS silicon-gate
• Single power supply (+3.3V ±0.3V or +5V ±0.5V)
• All inputs, outputs and clocks are TTL-compatible
• Refresh modes: RAS#-ONLY, HIDDEN and CAS#-
• Optional self refresh (S) for low-power data
• 11 row, 11 column addresses (2K refresh) or
• FAST-PAGE-MODE (FPM) access
• 5V tolerant inputs and I/Os on 3.3V devices
OPTIONS
• Voltage
• Refresh Addressing
• Packages
• Timing
• Refresh Rates
NOTE: 1. The 4 Meg x 4 FPM DRAM base number differenti-
*Contact factory for availability
KEY TIMING PARAMETERS
4 Meg x 4 FPM DRAM
D49_5V.p65 – Rev. 5/00
SPEED
and packages
process
BEFORE-RAS# (CBR)
retention
12 row, 10 column addresses (4K refresh)
3.3V
5V
2,048 (2K) rows
4,096 (4K) rows
Plastic SOJ (300 mil)
Plastic TSOP (300 mil)
50ns access
60ns access
Standard Refresh
Self Refresh (128ms period)
-5
-6
2. The # symbol indicates signal is active LOW.
110ns
ates the offerings in one place—MT4LC4M4B1. The
fifth field distinguishes various options: B1
designates a 2K refresh and A1 designates a 4K
refresh for FPM DRAMs.
84ns
t
RC
t
MT4LC4M4B1DJ
50ns
60ns
RAC
Part Number Example:
20ns
35ns
t
PC
25ns
30ns
t
AA
MARKING
t
13ns
15ns
CAC
None
TG
LC
A1
B1
DJ
-5
-6
S *
C
30ns
40ns
t
RP
1
MT4LC4M4B1, MT4C4M4B1
MT4LC4M4A1, MT4C4M4A1
For the latest data sheet, please refer to the Micron Web
site:
4 MEG x 4 FPM DRAM PART NUMBERS
**NC/A11
PART NUMBER
MT4LC4M4B1DJ-6
MT4LC4M4B1DJ-6 S 3.3V
MT4LC4M4B1TG-6
MT4LC4M4B1TG-6 S 3.3V
MT4LC4M4A1DJ-6
MT4LC4M4A1DJ-6 S 3.3V
MT4LC4M4A1TG-6
MT4C4M4A1TG-6 S 3.3V
MT4C4M4B1DJ-6
MT4C4M4B1DJ-6 S
MT4C4M4B1TG-6
MT4C4M4B1TG-6 S
MT4C4M4A1DJ-6
MT4C4M4A1DJ-6 S
MT4C4M4A1TG-6
MT4C4M4A1TG-6 S
**NC on 2K refresh and A11 on 4K refresh options.
RAS#
WE#
DQ0
DQ1
V
V
A10
CC
24/26-Pin SOJ
A0
A1
A2
A3
www.micronsemi.com/mti/msp/html/datasheet.html
CC
PIN ASSIGNMENT (Top View)
1
2
3
4
5
6
8
9
10
11
12
13
Micron Technology, Inc., reserves the right to change products or specifications without notice.
3.3V
3.3V
3.3V
3.3V
V
5V
5V
5V
5V
5V
5V
5V
5V
26
25
24
23
22
21
19
18
17
16
15
14
CC
ADDRESSING PACKAGE REFRESH
V
DQ3
DQ2
CAS #
OE #
A9
A8
A7
A6
A5
A4
V
SS
SS
REFRESH
**NC/A11
2K
2K
2K
2K
4K
4K
4K
4K
2K
2K
2K
2K
4K
4K
4K
4K
RAS#
WE#
DQ0
DQ1
24/26-Pin TSOP
V
A10
V
A0
A1
A2
A3
CC
CC
FPM DRAM
4 MEG x 4
1
2
3
4
5
6
8
9
10
11
12
13
TSOP
TSOP
TSOP
TSOP
TSOP
TSOP
TSOP
TSOP
SOJ
SOJ
SOJ
SOJ
SOJ
SOJ
SOJ
SOJ
©2000, Micron Technology, Inc.
OBSOLETE
Standard
Standard
Standard
Standard
Standard
Standard
Standard
Standard
26
25
24
23
22
21
19
18
17
16
15
14
Self
Self
Self
Self
Self
Self
Self
Self
V
DQ3
DQ2
CAS#
OE#
A9
A8
A7
A6
A5
A4
V
SS
SS

Related parts for MT4C4M4A1TG-5

MT4C4M4A1TG-5 Summary of contents

Page 1

... A11 on 4K refresh options MEG x 4 FPM DRAM PART NUMBERS DJ TG PART NUMBER MT4LC4M4B1DJ-6 -5 MT4LC4M4B1DJ-6 S 3.3V -6 MT4LC4M4B1TG-6 MT4LC4M4B1TG-6 S 3.3V None MT4LC4M4A1DJ MT4LC4M4A1DJ-6 S 3.3V MT4LC4M4A1TG-6 MT4C4M4A1TG-6 S 3.3V MT4C4M4B1DJ-6 MT4C4M4B1DJ-6 S MT4C4M4B1TG-6 MT4C4M4B1TG-6 S MT4C4M4A1DJ-6 MT4C4M4A1DJ-6 S MT4C4M4A1TG-6 MT4C4M4A1TG CAC RP 25ns 13ns 30ns 30ns ...

Page 2

... GENERAL DESCRIPTION The 4 Meg x 4 DRAM is a randomly accessed, solid- state memory containing 16,777,216 bits organized configuration. RAS# is used to latch the row address (first 11 bits for 2K and first 12 bits for 4K). Once the page has been opened by RAS#, CAS# is used to latch the column address (the latter 11 bits for 2K and the latter 10 bits for 4K ...

Page 3

... CONTROLLER REFRESH A7 COUNTER A10 ROW- A11 ADDRESS 12 BUFFERS (12) NO. 1 CLOCK RAS# GENERATOR 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/ 2,048 2,048 2,048 11 2,048 2,048 10 4,096 12 4,096 4,096 3 Micron Technology, Inc., reserves the right to change products or specifications without notice. OBSOLETE 4 MEG x 4 FPM DRAM ...

Page 4

... V Any output at V OUT OUT DQ is disabled and in High-Z state 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 *Stresses greater than those listed under “Absolute Maxi- mum Ratings” may cause permanent damage to the SS device. This is a stress rating only, and functional opera- ...

Page 5

... A0-A11, OE# and 0.2V or 0.2V (D may be left open CAPACITANCE (Note: 6) PARAMETER Input Capacitance: Address pins Input Capacitance: RAS#, CAS#, WE#, OE# Input/Output Capacitance Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 2K SYM SPEED REFRESH REFRESH REFRESH REFRESH UNITS NOTES I ALL ALL 500 ...

Page 6

... RAS# pulse width during Self Refresh Random READ or WRITE cycle time RAS# to CAS# delay time READ command hold time (referenced to CAS#) READ command setup time Refresh period (2,048 cycles) Refresh period (4,096 cycles) 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 -5 SYMBOL MIN MAX MIN ...

Page 7

... Transition time (rise or fall) WRITE command hold time WRITE command hold time (referenced to RAS#) WE# command setup time WRITE command pulse width WE# hold time (CBR Refresh) WE# setup time (CBR Refresh) 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 -5 SYMBOL MIN MAX MIN ...

Page 8

... RAD (MAX) was specified as a reference point t only. If RAD was greater than the specified t RAD (MAX) limit, then access time was con- 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 . trolled exclusively by = +3.3V or 5.0V; CC longer applied). With or without the (MAX) limit, be met ...

Page 9

... CAC 13 t CAH 8 t CAS 8 10,000 t CLZ 0 t CRP 5 t CSH Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 READ CYCLE RAS t CSH t RSH t RCD t CAS RAD t RAH t ASC t CAH COLUMN t RCS RAC t CAC t CLZ OPEN -6 MAX UNITS SYMBOL t 30 ...

Page 10

... CAH 8 t CAS 8 10,000 t CRP 5 t CSH 38 t CWL RAD 9 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 EARLY WRITE CYCLE RAS t CSH t RSH t RCD t CAS RAD t RAH t ASC t CAH COLUMN t CWL t RWL t WCR t WCS t WCH VALID DATA -6 MAX ...

Page 11

... CAS 8 10,000 t CLZ 0 t CRP 5 t CSH 38 t CWD 28 t CWL Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 READ-WRITE CYCLE t RWC t RAS t CSH t RSH t RCD t CAS RAD t RAH t ASC t CAH COLUMN t RWD t RCS t CWD t AWD RAC t CAC t CLZ OPEN t OE ...

Page 12

... CAC 13 t CAH 8 t CAS 8 10,000 t CLZ CPA 28 t CRP 5 t CSH Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 FAST-PAGE-MODE READ CYCLE t RASP RCD t CAS ASC t CAH t ASC COLUMN COLUMN t RCS t RCH RAC t CAC t OFF t CLZ t CLZ VALID DATA MAX ...

Page 13

... CAH 8 t CAS 8 10,000 CRP 5 t CSH 38 t CWL Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 FAST-PAGE-MODE EARLY WRITE CYCLE t RASP RCD t CAS ASC t CAH t ASC COLUMN COLUMN t CWL t WCH t WCS WCR VALID DATA VALID DATA -6 MAX UNITS SYMBOL t 45 ...

Page 14

... CPA 28 t CRP 5 t CSH 38 t CWD 28 t CWL NOTE for LATE WRITE only. 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 FAST-PAGE-MODE READ-WRITE CYCLE t RASP t CSH NOTE 1 t RCD t CAS ASC t CAH t ASC COLUMN COLUMN t RWD t RCS t CWL AWD t CWD ...

Page 15

... CLZ CRP 5 t CSH 38 t CWL NOTE not drive data prior to tristate. 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 (Pseudo READ-MODIFY-WRITE) t RASP t CSH t RCD t CAS RAD t ASC t CAH COLUMN t RCS t CAC t CLZ t OFF VALID OPEN DATA RAC -6 MAX UNITS ...

Page 16

... CRP 5 t CSR 5 t RAH 9 NOTE: 1. End of CBR REFRESH cycle. 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 RAS#-ONLY REFRESH CYCLE (OE# and WE# = DON’T CARE RAS t RAH ROW OPEN CBR REFRESH CYCLE (Addresses and OE# = DON’T CARE) t RAS t RP NOTE 1 ...

Page 17

... CHR 8 t CLZ 0 t CRP NOTE HIDDEN REFRESH may also be performed after a WRITE cycle. In this case, WE# is LOW and OE# is HIGH. 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 HIDDEN REFRESH CYCLE (WE# = HIGH; OE# = LOW) t RAS RCD t RSH RAD t ASC t CAH COLUMN ...

Page 18

... NOTE: 1. Once RASS (MIN) is met and RAS# remains LOW, the DRAM will enter self refresh mode Once RPS is satisfied, a complete burst of all rows should be executed if RAS#-only or burst CBR refresh is used. 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 SELF REFRESH CYCLE (Addresses and OE# = DON’ ...

Page 19

... DAMBAR PROTRUSION SEATING PLANE NOTE: 1. All dimensions in inches (millimeters) 2. Package width and length do not include mold protrusion; allowable mold protrusion is .01" per side. 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 24/26-PIN PLASTIC SOJ (300 mil) .679 (17.25) .673 (17.09) .032 (0.81) ...

Page 20

... S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992 Micron is a registered trademark of Micron Technology, Inc. 4 Meg x 4 FPM DRAM D49_5V.p65 – Rev. 5/00 24/26-PIN PLASTIC TSOP (300 mil) .367 (9.32) ...

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