BA6246N Rohm Semiconductor, BA6246N Datasheet - Page 13

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BA6246N

Manufacturer Part Number
BA6246N
Description
Reversible Motor Driver 10-Pin SIP Tube
Manufacturer
Rohm Semiconductor
Type
Reversible Motor Driverr
Datasheet

Specifications of BA6246N

Package
10SIP
Maximum Operating Current
15 mA
Operating Temperature
-25 to 75 °C

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BA6246N
Manufacturer:
ROHM
Quantity:
39
 Interfaces
 Notes for use
BA6246, BA6246N, BA6247FP-Y, BA6239A, BA6238A, BA6238AN
c
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2009 ROHM Co., Ltd. All rights reserved.
1) Absolute maximum ratings
2) Connecting the power supply connector backward
3) Power supply lines
4) Electrical potential at GND
5) Thermal design
6) Inter-pin shorts and mounting errors
Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating.
Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important
to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is
to be implemented.
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply lines, such as adding an external direction diode.
Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path
by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is
important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors –
including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient
current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which
may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To
help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage
clamping diode across the power supply and GND.
Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to
determine whether there is any terminal that provides voltage below GND, including the voltage during transient
phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set’s
reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that
voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the
same way, care must be taken to avoid changes in the GND wire pattern in any external connected component.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating
conditions.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error, or if pins are shorted together.
Fig. 38 IN1, IN2, IN3
IN1
IN2
IN3
15k
5k
7k
VREG
(BA6246, BA6246N, BA6247FP-Y)
VR
Fig.39 VCC1, VCC2, OUT1, OUT2, OUT3, VR, GND
13/15
VCC2
VCC1
OUT1
OUT2
OUT3
GND
(BA6239A)
VCC2
VR
OUT1
OUT2
OUT3
GND
(BA6238A, BA6238AN)
VR
Technical Note
2009.04 - Rev.A
VCC2
VCC1
OUT1
OUT2
OUT3
GND

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