ISL5416KI Intersil, ISL5416KI Datasheet - Page 57

• Manufacturer Part Number: ISL5416KI
• Description: Up/Down Conv Mixer 1.8V 256-Pin BGA
• Manufacturer: Intersil

Specifications of ISL5416KI

• Package: 256BGA
• Operating Supply Voltage: 1.8 V

Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 (core)
Input, Output or I/O Voltage . . . . . . . . . . . . . . . . . GND -0.5V to 5.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class I
Operating Conditions
Voltage Range I/O, V
Voltage Range core, V
Temperature Range
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 2V to I/O V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: NOTE: θ
air or with the airflow. See Tech Brief TB379 for details
Electrical Specifications
NOTES:
Logical One Input Voltage
Logical Zero Input Voltage
Output High Voltage
Output Low Voltage
Input Leakage Current
Output Leakage Current
Standby Power Supply Current
(core)
Standby Power Supply Current
(IO’s)
Operating Power Supply Current
(core)
Operating Power Supply Current
(IO’s)
Operating Power Supply Core
Current (typical)
Input Capacitance
Output Capacitance
1. Power Supply current is proportional to frequency of operation and programmed configuration of the part. Typical rating for I
2. Capacitance: T
3. Typical Pull-up/down resistance values are 60 kΩ.
4. Typical measured power on the Evaluation board:
Industrial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
process or design changes.
•. UMTS: CLK = 76.8 MHz, Total Power = 1.1 W (core current = 500 mA; I/O current = 60 mA)
•. CDMA2000: CLK = 80 MHz, Total Power = 750 mW (core current = 360 mA; I/O current = 30 mA).
PARAMETER
JA
is measured with the component mounted on a high effective thermal conductivity test board with “direct attach” features in free
A
CCIO
= 25
CCC
o
. . . . . . . . . . . . . . . . . +3.135V to +3.465V
C, controlled via design or process parameters and not directly tested. Characterized upon initial design and at major
. . . . . . . . . . . . . . . . . . +1.71V to +1.89V
57
V
CCC
I
I
I
CCOP-TYP
SYMBOL
I
I
CCOP-CR
CCSB-CR
CCOP-IO
CCSB-IO
C
V
V
V
C
V
= Core supply: 1.8V ± 0.09V, T
OUT
I
OH
OL
I
O
IH
IN
IL
I
V
V
I
I
V
V
V
CLK
V
No CLK
f = 80MHz, V
V
f = 80MHz, V
V
f = 80MHz, V
V
Freq = 1MHz, V
are referenced to device ground
OH
OL
CCIO
CCIO
IN
IN
CCC
CCC
CCC
CCC
CCC
= 2mA, V
= V
= V
= -2mA, V
o
= 1.89V, See AC Test load circuit,
C to 85
= 1.89V, See AC Test load circuit, No
= 1.89V, See AC Test load circuit,
4.6 (I/O’s)
= 1.89V, See AC Test load circuit,
= 1.89V, See AC Test load circuit,
= 3.45V
= 3.15V
CCIO
CCIO
CCIO
TEST CONDITIONS
IN
IN
IN
CCC
or GND, V
or GND, V
o
CCC
C
ISL5416
CCC
= V
= V
= V
= 3.15V
CCC
CCC
CCC
= 3.15V
open, all measurements
A
= -40
CCIO
CCIO
or GND,
or GND,
or GND,
Thermal Information
Thermal Resistance (Typical)
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150
Maximum Storage Temperature Range . . . . . . . . . . -65
For recommended soldering conditions see Tech Brief 334.
o
256 Lead BGA Package. . . . . . . . . . . . . . . . . . . . . .
w/200 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
w/400 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
C to 85
= 3.465V
= 3.465V
o
C, Industrial
MIN
2.0
2.6
-10
-10
(NOTE 1, 4)
TYPICAL
(NOTE 3)
500
0.1
< 1
3
(NOTE 6)
MAX
0.75
660
150
0.8
0.4
CCOP
10
10
12
5
5
is 6.5 mA/MHz.
o
θ
C to 150
(Note 2)
(Note 2)
UNITS
JA
mA
mA
mA
mA
mA
µA
µA
pF
pF
V
V
V
V
(
31
28
26
o
C/W)
o
o
C
C