HY27US08281A-TPCB Hynix, HY27US08281A-TPCB Datasheet - Page 10

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HY27US08281A-TPCB

Manufacturer Part Number
HY27US08281A-TPCB
Description
Flash Mem Parallel 3.3V 128M-Bit 16M x 8 10us 48-Pin TSOP-I
Manufacturer
Hynix
Datasheet

Specifications of HY27US08281A-TPCB

Package
48TSOP-I
Cell Type
NAND
Density
128 Mb
Architecture
Sectored
Block Organization
Symmetrical
Typical Operating Supply Voltage
3.3 V
Sector Size
16KByte x 1024
Support Of Page Mode
Yes
Timing Type
Asynchronous
Operating Temperature
0 to 70 °C
Interface Type
Parallel

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HY27US(08/16)281A Series
128Mbit (16Mx8bit / 8Mx16bit) NAND Flash
2. BUS OPERATION
There are six standard bus operations that control the device. These are Command Input, Address Input, Data Input,
Data Output, Write Protect, and Standby.
Typically glitches less than 5 ns on Chip Enable, Write Enable and Read Enable are ignored by the memory and do not
affect bus operations.
2.1 Command Input.
Command Input bus operation is used to give a command to the memory device. Command are accepted with Chip
Enable low, Command Latch Enable High, Address Latch Enable low and Read Enable High and latched on the rising
edge of Write Enable. Moreover for commands that starts a modifying operation (write/erase) the Write Protect pin
must be high. See figure 5 and table 12 for details of the timings requirements. Command codes are always applied on
IO7:0, disregarding the bus configuration (X8/X16).
2.2 Address Input.
Address Input bus operation allows the insertion of the memory address. Three cycles are required to input the
addresses for the 128Mbit devices. Addresses are accepted with Chip Enable low, Address Latch Enable High, Com-
mand Latch Enable low and Read Enable high and latched on the rising edge of Write Enable. Moreover for commands
that starts a modify operation (write/erase) the Write Protect pin must be high. See figure 6 and table 10 for details of
the timings requirements. Addresses are always applied on IO7:0, disregarding the bus configuration (X8/X16).
In addition, addresses over the addressable space (A23 for 128Mbit) are disregarded even if the user sets them during
command insertion.
2.3 Data Input.
Data Input bus operation allows to feed to the device the data to be programmed. The data insertion is serially and
timed by the Write Enable cycles. Data are accepted only with Chip Enable low, Address Latch Enable low, Command
Latch Enable low, Read Enable High, and Write Protect High and latched on the rising edge of Write Enable. See figure
7 and table 12 for details of the timings requirements.
2.4 Data Output.
Data Output bus operation allows to read data from the memory array and to check the status register content, the
lock status and the ID data. Data can be serially shifted out toggling the Read Enable pin with Chip Enable low, Write
Enable High, Address Latch Enable low, and Command Latch Enable low. See figures 8 to 12 and table 12 for details
of the timings requirements.
2.5 Write Protect.
Hardware Write Protection is activated when the Write Protect pin is low. In this condition modify operation do not
start and the content of the memory is not altered. Write Protect pin is not latched by Write Enable to ensure the pro-
tection even during the power up.
2.6 Standby.
In Standby mode the device is deselected, outputs are disabled and Power Consumption is reduced.
Rev 0.6 / Nov. 2005
10

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