MT47H16M16FG-37E Micron Technology Inc, MT47H16M16FG-37E Datasheet - Page 18

• Manufacturer Part Number: MT47H16M16FG-37E
• Description: DRAM Chip DDR2 SDRAM 256M-Bit 16Mx16 1.8V 84-Pin FBGA Tray
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H16M16FG-37E

• Package: 84FBGA
• Density: 256 Mb
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Clock Rate: 533 MHz
• Maximum Random Access Time: 0.5 ns
• Operating Temperature: 0 to 85 °C

Figure 9: 60-Ball, FBGA Package (8mm x 12mm) – x4, x8
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Solder ball material:
Pb-free – (SAC305) SnAgCu
Pb – (Eutectic) SnPbAg
Dimensions apply to solder
balls post-reflow.
Seating plane
60X Ø0.45
0.12 C
0.8 TYP
Note:
C
1. All dimensions are in millimeters.
0.8 TYP
8.0 ±0.15
6.4
C L
C L
18
0.8 ±0.1
8.0
Ball A1 ID
12.0 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
©2003 Micron Technology, Inc. All rights reserved.
Ball A1 ID location
Packaging