MT47H16M16FG-37E Micron Technology Inc, MT47H16M16FG-37E Datasheet - Page 21

• Manufacturer Part Number: MT47H16M16FG-37E
• Description: DRAM Chip DDR2 SDRAM 256M-Bit 16Mx16 1.8V 84-Pin FBGA Tray
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H16M16FG-37E

• Package: 84FBGA
• Density: 256 Mb
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Clock Rate: 533 MHz
• Maximum Random Access Time: 0.5 ns
• Operating Temperature: 0 to 85 °C

Table 6: Temperature Limits
Figure 10: Example Temperature Test Point Location
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Parameter
Storage temperature
Operating temperature: commercial
Operating temperature: industrial
Operating temperature: automotive
Notes:
Test point
1. MAX storage case temperature T
2. MAX operating case temperature T
3. Device functionality is not guaranteed if the device exceeds maximum T
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
in Figure 10. This case temperature limit is allowed to be exceeded briefly during pack-
age reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering
Parameters.”
in Figure 10.
Lmm x Wmm FBGA
Width (W)
0.5 (W)
0.5 (L)
Length (L)
Electrical Specifications – Absolute Ratings
21
STG
Symbol
T
C
T
T
T
T
T
Micron Technology, Inc. reserves the right to change products or specifications without notice.
STG
is measured in the center of the package, as shown
is measured in the center of the package, as shown
C
C
A
C
A
256Mb: x4, x8, x16 DDR2 SDRAM
Min
–55
–40
–40
–40
–40
0
Max
150
105
105
85
95
85
©2003 Micron Technology, Inc. All rights reserved.
Units
°C
°C
°C
°C
°C
°C
C
during operation.
Notes
2, 3, 4
2, 3, 4
2, 3
4, 5
4, 5
1