XC3S2000-4FG676C Xilinx Inc, XC3S2000-4FG676C Datasheet - Page 122

• Manufacturer Part Number: XC3S2000-4FG676C
• Description: FPGA Spartan®-3 Family 2M Gates 46080 Cells 630MHz 90nm Technology 1.2V 676-Pin FBGA
• Manufacturer: Xilinx Inc

Specifications of XC3S2000-4FG676C

• Package: 676FBGA
• Family Name: Spartan®-3
• Device Logic Units: 46080
• Device System Gates: 2000000
• Maximum Internal Frequency: 630 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 489
• Ram Bits: 737280

Spartan-3 FPGA Family: Pinout Descriptions
Package Thermal Characteristics
The power dissipated by an FPGA application has implica-
tions on package selection and system design. The power
consumed by a Spartan-3 FPGA is reported using either
the
grated in the Xilinx ISE development software.
vides the thermal characteristics for the various Spartan-3
package offerings.
The junction-to-case thermal resistance (θ
difference between the temperature measured on the pack-
122
XPower
Estimator (XPE) or the XPower Analyzer inte-
JC
) indicates the
Table 85
www.xilinx.com
pro-
age body (case) and the die junction temperature per watt
of power consumption. The junction-to-board (θ
similarly reports the difference between the board and junc-
tion temperature. The junction-to-ambient (θ
reports the temperature difference per watt between the
ambient environment and the junction temperature. The θ
value is reported at different air velocities, measured in lin-
ear feet per minute (LFM). The “Still Air (0 LFM)” column
shows the θ
resistance drops with increasing air flow.
JA
value in a system without a fan. The thermal
DS099-4 (v2.5) December 4, 2009
Product Specification
JA
JB
) value
) value
JA
R