LPC1777FBD208,551 NXP Semiconductors, LPC1777FBD208,551 Datasheet - Page 70
LPC1777FBD208,551
Manufacturer Part Number
LPC1777FBD208,551
Description
IC MCU 32BIT 512KB FLASH 208LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheet
1.LPC1774FBD208551.pdf
(117 pages)
Specifications of LPC1777FBD208,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, EBI/EMI, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
165
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-7570
LPC1777FBD208,551
LPC1777FBD208,551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1777FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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9. Thermal characteristics
Table 10.
V
LPC178X_7X
Objective data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
J
•
•
•
=
T
R
P
40
amb
D
th(j-a)
T
amb
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
= the package junction-to-ambient thermal resistance (C/W)
+
P
D
All information provided in this document is subject to legal disclaimers.
Conditions
C unless otherwise specified;
R
th j a
–
Rev. 2 — 27 May 2011
J
(C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
LPC178x/7x
Max
125
© NXP B.V. 2011. All rights reserved.
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