STM8L151G3U6 STMicroelectronics, STM8L151G3U6 Datasheet - Page 97
STM8L151G3U6
Manufacturer Part Number
STM8L151G3U6
Description
IC MCU 8BIT 8KB FLASH 28UFQFPN
Manufacturer
STMicroelectronics
Series
STM8L EnergyLiter
Datasheet
1.STM8L151G3U6.pdf
(110 pages)
Specifications of STM8L151G3U6
Core Processor
STM8
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, IR, POR, PWM, WDT
Number Of I /o
26
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 18x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-UFQFN
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-11494
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM8L151G3U6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM8L151G3U6
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
STM8L151G3U6TR
Manufacturer:
SAMSUNG
Quantity:
340
Company:
Part Number:
STM8L151G3U6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM8L151x2, STM8L151x3
Table 54.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol
taking into account the actual V
the application.
Θ
Θ
Θ
Θ
Θ
JA
JA
JA
JA
JA
Thermal characteristics
Thermal resistance junction-ambient
LQFP 48- 7 x 7 mm
Thermal resistance junction-ambient
UFQFPN 32 - 5 x 5 mm
Thermal resistance junction-ambient
UFQFPN28 - 4 x 4 mm
Thermal resistance junction-ambient
UFQFPN20 - 3 x 3 mm
Thermal resistance junction-ambient
TSSOP20
Doc ID 018780 Rev 2
Parameter
OL
(1)
/I
OL
and V
OH
/I
OH
of the I/Os at low and high level in
Electrical parameters
Value
102
110
65
38
80
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
97/110