KMA199E T/R NXP Semiconductors, KMA199E T/R Datasheet - Page 29

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KMA199E T/R

Manufacturer Part Number
KMA199E T/R
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of KMA199E T/R

Operating Temperature (min)
-40C
Operating Supply Voltage (typ)
5V
Lead Free Status / Rohs Status
Compliant
NXP Semiconductors
20. Handling information
21. Solderability information
22. Revision history
Table 26.
KMA199E_1
Product data sheet
Document ID
KMA199E_1
Revision history
The solderability qualification is done according to AEC-Q100, Rev-E. Recommended
soldering process for leaded devices is wave soldering. The maximum soldering
temperature is 260 C for maximum 5 s. Device terminals shall be compatible with laser
and electrical welding.
Fig 19. Bending recommendation
Release date
20071018
(1) No bending allowed.
(2) Plastic body and interface plastic body - leads: application of bending forces not allowed.
Dimensions in mm
Data sheet status
Product data sheet
Rev. 01 — 18 October 2007
(2)
R 0.25 min
0.7
(1)
0.7
(1)
R 0.25 min
006aaa246
0.7
(1)
Change notice
-
(2)
Programmable angle sensor
Supersedes
-
KMA199E
© NXP B.V. 2007. All rights reserved.
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