KMZ51 NXP Semiconductors, KMZ51 Datasheet - Page 4

• Manufacturer Part Number: KMZ51
• Manufacturer: NXP Semiconductors

Specifications of KMZ51

• Power Dissipation: 130mW
• Operating Temperature (min): -40C
• Operating Temperature (max): 125C
• Package Type: SO
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 8V
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
THERMAL CHARACTERISTICS
CHARACTERISTICS
T
2000 Jun 13
R
V
H
H
S
TCS
TCV
R
TCR
V
TCV
FH
R
A
R
TCR
I
t
R
V
f
amb
flip
flip
SYMBOL
SYMBOL
CC
offset
comp
isol
th j-a
y
x
bridge
comp
flip
isol
Magnetic field sensor
= 25 C unless otherwise specified.
O
offset
bridge
flip
thermal resistance from junction to ambient
bridge supply voltage
operating range in sensitive direction
operating range perpendicular to
sensitive direction
sensitivity
temperature coefficient of sensitivity
temperature coefficient of output voltage V
bridge resistance
temperature coefficient of bridge
resistance
offset voltage
temperature coefficient of offset voltage
hysteresis of output voltage
resistance of compensation coil
field factor of compensation coil
resistance of set/reset conductor
temperature coefficient of resistance of
set/reset coil
recommended flipping current for stable
operation
flip pulse duration
isolating resistance
voltage between isolated systems
operating frequency
PARAMETER
PARAMETER
open circuit
T
T
I
T
resistance pins 2 to 3
T
T
resistance pins 4 to 5
resistance pins 1 to 8
T
resistance pins 1 to 2,
1 to 4 and 2 to 4
voltage pins 1 to 2, 1 to 4
and 2 to 4
CC
s
amb
amb
bridge
bridge
flip
4
CC
= 25 to +125 C
= 25 to +125 C
3 mA;
= 5 V;
= 25 to +125 C
= 25 to +125 C
CONDITIONS
= 25 to +125 C
= 25 to +125 C
12
1
100
19
1
1
1
0
MIN.
0.2
0.2
1.5
3
800
VALUE
155
5
16
0.31
0.3
0
0
170
22
2
0.39
3
TYP.
0.4
0.1
1000
Product specification
8
3
+3
2
300
25
3
100
50
1
MAX.
0.2
0.2
1.5
1200 mA
KMZ51
UNIT
K/W
V
kA/m
kA/m
%/K
%/K
%/K
k
%/K
mV/V
%FS
%/K
m
V
MHz
mV/V
------------- -
------------ -
A/m
--------- -
kA/m
mA
UNIT
s
V/V
K