LTC4271IUF#PBF Linear Technology, LTC4271IUF#PBF Datasheet - Page 30
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LTC4271IUF#PBF
Manufacturer Part Number
LTC4271IUF#PBF
Description
Manufacturer
Linear Technology
Datasheet
1.LTC4271IUFPBF.pdf
(32 pages)
Specifications of LTC4271IUF#PBF
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Pin Count
24
Mounting
Surface Mount
Package Type
QFN EP
Case Length
4mm
Screening Level
Industrial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
LTC4270/LTC4271
PACKAGE DESCRIPTION
30
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4.50 0.05
(WGGD-X)—TO BE APPROVED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
3.10 0.05
2.45 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
TOP MARK
(NOTE 6)
4.00 0.10
(4 SIDES)
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
0.50 BSC
0.25 0.05
0.70 0.05
PACKAGE OUTLINE
UF Package
0.75 0.05
0.200 REF
0.00 – 0.05
2.45 0.10
(4-SIDES)
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
R = 0.115
BOTTOM VIEW—EXPOSED PAD
ON THE TOP AND BOTTOM OF PACKAGE
TYP
23
24
0.50 BSC
0.25 0.05
1
2
(UF24) QFN 0105
0.40 0.10
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 ¥ 45 CHAMFER
42701f