UPC8187TB-E3-A Renesas Electronics America, UPC8187TB-E3-A Datasheet - Page 31

• Manufacturer Part Number: UPC8187TB-E3-A
• Manufacturer: Renesas Electronics America

Specifications of UPC8187TB-E3-A

• Lead Free Status / Rohs Status: Supplier Unconfirmed

15. NOTE ON CORRECT USE
16. RECOMMENDED SOLDERING CONDITIONS
tions other than those recommended below, contact your NEC sales representative.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Infrared Reflow
VPS
Wave Soldering
Partial Heating
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Connect a bypass capacitor to the V
(4) Connect a matching circuit to the RF output pin.
(5) The DC cut capacitor must be each attached to the input and output pins.
This product should be soldered under the following recommended conditions. For soldering methods and condi-
Note After opening the dry pack, keep it in a place below 25 C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
Soldering Method
Package peak temperature: 235 C or below
Time: 30 seconds or less (at 210 C)
Count: 3, Exposure limit: None
Package peak temperature: 215 C or below
Time: 40 seconds or less (at 200 C)
Count: 3, Exposure limit: None
Soldering bath temperature: 260 C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Pin temperature: 300 C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
CC
Soldering Conditions
pin.
Data Sheet P15106EJ2V0DS
Note
Note
Note
Recommended Condition Symbol
WS60-00-1
VP15-00-3
IR35-00-3
PC8187TB
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