UPB1507GV-E1 Renesas Electronics America, UPB1507GV-E1 Datasheet - Page 18

• Manufacturer Part Number: UPB1507GV-E1
• Manufacturer: Renesas Electronics America

Specifications of UPB1507GV-E1

• Lead Free Status / Rohs Status: Supplier Unconfirmed

NOTE CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 10 000 pF) to the V
RECOMMENDED SOLDERING CONDITIONS
conditions than the recommended conditions are to be consulted with our sales representatives.
P P P P PB1506GV, P P P P PB1507GV
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
18
Infrared ray reflow
VPS
Wave soldering
Pin part heating
Soldering method
* It is the storage days after opening a dry pack, the storage conditions are 25 qC, less than 65 % RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
This product should be soldered in the following recommended conditions.
For details of recommended soldering conditions for surface mounting, refer to information document
method).
Package peak temperature: 235 qC,
Hour: within 30 s. (more than 210 qC),
Time: 3 times, Limited days: no.*
Package peak temperature: 215 qC,
Hour: within 40 s. (more than 200 qC),
Time: 3 times, Limited days: no.*
Soldering tub temperature: less than 260 qC,
Hour: within 10 s.,
Time: 1 time, Limited days: no.
Pin area temperature: less than 300 qC,
Hour: within 3 s./pin,
Limited days: no.*
Soldering conditions
CC
pin.
P P P P PB1506GV, P P P P PB1507GV
Recommended condition symbol
Other soldering methods and
WS60-00-1
VP15-00-3
IR35-00-3