C2012X6S0J106M TDK Corporation, C2012X6S0J106M Datasheet - Page 13

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C2012X6S0J106M

Manufacturer Part Number
C2012X6S0J106M
Description
CAP CER 10UF 6.3V 20% X6S 0805
Manufacturer
TDK Corporation
Series
Cr

Specifications of C2012X6S0J106M

Capacitance
10µF
Voltage - Rated
6.3V
Tolerance
±20%
Temperature Coefficient
X6S
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 105°C
Applications
General Purpose
Ratings
-
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Height - Seated (max)
-
Thickness (max)
0.037" (0.95mm)
Lead Spacing
-
Features
-
Lead Style
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-7618-2
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness : Appendix-2a
Applied for C0603, C1005, C1608, C2012, C3216
(Unit : mm)
P.C. Board for reliability test
P.C. Board for bending test
c
Solder resist
Solder resist
Applied for C0603, C1005
Copper ( thickness 0.035mm )
Solder resist
Appendix - 1a
Appendix - 2a
100
Appendix-1a, 1b, 2b
b
100
Copper
b
a
(Unit:mm)
Copper
1.6mm
—— 12 ——
0.8mm
Applied for C1608, C2012, C3216, C3225, C4532, C5750
P.C. Board for reliability test
C0603 (CC0201)
C1005 (CC0402)
C1608 (CC0603)
C2012 (CC0805)
C3216 (CC1206)
C3225 (CC1210)
C4532 (CC1812)
C5750 (CC2220)
P.C. Board for bending test
TDK (EIA style)
c
Solder resist
Applied for C3225, C4532, C5750
Slit
Appendix - 1b
Appendix - 2b
100
b
100
Solder resist
a
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
a
Dimensions (mm)
Copper
0.8
1.5
3.0
4.0
5.0
5.0
7.0
8.0
(Unit : mm)
b
Copper
(Unit : mm)
1.65
0.3
0.5
1.2
2.0
2.9
3.7
5.6
c

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