LTC3589EUJ-1#PBF Linear Technology, LTC3589EUJ-1#PBF Datasheet - Page 44

• Manufacturer Part Number: LTC3589EUJ-1#PBF
• Manufacturer: Linear Technology

Specifications of LTC3589EUJ-1#PBF

• Lead Free Status / Rohs Status: Compliant

PACKAGE DESCRIPTION
LTC3589/LTC3589-1
44
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
PIN 1 TOP MARK
(SEE NOTE 6)
4.42 ±0.05
6.00 ± 0.10
(4 SIDES)
4.42 ±0.05
0.50 BSC
0.25 ±0.05
(Reference LTC DWG # 05-08-1728 Rev Ø)
40-Lead Plastic QFN (6mm × 6mm)
0.70 ±0.05
4.50 ±0.05
PACKAGE OUTLINE
(4 SIDES)
0.75 ± 0.05
UJ Package
5.10 ±0.05
(4-SIDES)
4.50 REF
0.200 REF
0.00 – 0.05
R = 0.10
6.50 ±0.05
TYP
R = 0.115
4.42 ±0.10
BOTTOM VIEW—EXPOSED PAD
TYP
PIN 1 NOTCH
R = 0.45 OR
4.42 ±0.10
0.35 × 45°
CHAMFER
39
0.50 BSC
0.25 ± 0.05
40
(UJ40) QFN REV Ø 0406
0.40 ± 0.10
1
2
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