EFM32TG110F32-QFN24 Energy Micro, EFM32TG110F32-QFN24 Datasheet - Page 22

• Manufacturer Part Number: EFM32TG110F32-QFN24
• Description: MCU 32-Bit EFM32 ARM Cortex M3 RISC 32KB Flash 2.5V/3.3V 24-Pin QFN EP
• Manufacturer: Energy Micro

Specifications of EFM32TG110F32-QFN24

• Package: 24QFN EP
• Device Core: ARM Cortex M3
• Family Name: EFM32
• Maximum Speed: 32 MHz
• Ram Size: 4
• Program Memory Size: 32
• Operating Supply Voltage: 2.5|3.3 V
• Data Bus Width: 32 Bit
• Program Memory Type: Flash
• Number Of Programmable I/os: 17
• Interface Type: I2C/I2S/SPI/UART/USART
• On-chip Adc: 2-chx12-bit
• On-chip Dac: 1-chx12-bit
• Operating Temperature: -40 to 85 °C
• Number Of Timers: 3

3.9 Oscillators
3.9.1 LFXO
2011-07-26 - d0013_Rev0.92
Table 3.9. LFXO
For safe startup of a given crystal, the load capacitance should be larger than the value indicated in
Figure 3.10 (p. 23) and in Table 3.10 (p. 23) for a given LFXOBOOST setting. The minimum
supported load capacitance depends on the crystal shunt capacitance, C
vendors’ datasheet.
Symbol
f
ESR
C
DC
I
t
LFXO
LFXO
LFXO
LFXOL
LFXO
LFXO
Parameter
Supported nominal crystal
frequency
Supported crystal equiv-
alent series resistance
(ESR)
Supported crystal external
load range
Duty cycle
Current consumption for
core and buffer after start-
up.
Start- up time.
Condition
ESR=30 kOhm, C
LFXOBOOST in CMU_CTRL
is 1
ESR=30 kOhm, C
40% - 60% duty cycle has
been reached, LFXOBOOST
in CMU_CTRL is 1
...the world's most energy friendly microcontrollers
22
L
L
=10 pF,
=10 pF,
Min
48
5
0
, which is specified in crystal
Typ
32.768
www.energymicro.com
190
400
30
50
Max
53.5 %
120 kOhm
25 pF
Unit
kHz
nA
ms