EFM32TG110F32-QFN24 Energy Micro, EFM32TG110F32-QFN24 Datasheet - Page 57

no-image

EFM32TG110F32-QFN24

Manufacturer Part Number
EFM32TG110F32-QFN24
Description
MCU 32-Bit EFM32 ARM Cortex M3 RISC 32KB Flash 2.5V/3.3V 24-Pin QFN EP
Manufacturer
Energy Micro
Datasheet

Specifications of EFM32TG110F32-QFN24

Package
24QFN EP
Device Core
ARM Cortex M3
Family Name
EFM32
Maximum Speed
32 MHz
Ram Size
4
Program Memory Size
32
Operating Supply Voltage
2.5|3.3 V
Data Bus Width
32 Bit
Program Memory Type
Flash
Number Of Programmable I/os
17
Interface Type
I2C/I2S/SPI/UART/USART
On-chip Adc
2-chx12-bit
On-chip Dac
1-chx12-bit
Operating Temperature
-40 to 85 °C
Number Of Timers
3

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EFM32TG110F32-QFN24
Manufacturer:
FOXCONN
Quantity:
1 001
Part Number:
EFM32TG110F32-QFN24
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
...the world's most energy friendly microcontrollers
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32TG110 Memory Map with largest RAM and Flash sizes ........................................................................ 8
3.1. EM2 current consumption. RTC prescaled to 1kHz, 32 kHz LFRCO. .............................................................. 12
3.2. EM3 current consumption. ..................................................................................................................... 12
3.3. EM4 current consumption. ..................................................................................................................... 12
3.4. Typical Low-Level Output Current, 2V Supply Voltage .................................................................................. 16
3.5. Typical High-Level Output Current, 2V Supply Voltage ................................................................................. 17
3.6. Typical Low-Level Output Current, 3V Supply Voltage .................................................................................. 18
3.7. Typical High-Level Output Current, 3V Supply Voltage ................................................................................. 19
3.8. Typical Low-Level Output Current, 3.8V Supply Voltage ............................................................................... 20
3.9. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................... 21
3.10. Minimum Load Capacitance (C
) Requirement For Safe Crystal Startup ................................................... 23
LFXOL
3.11. Calibrated LFRCO Frequency vs Temperature and Supply Voltage .............................................................. 25
3.12. Integral Non-Linearity (INL) ................................................................................................................... 30
3.13. Differential Non-Linearity (DNL) .............................................................................................................. 30
3.14. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 31
3.15. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 32
3.16. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 33
3.17. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 34
3.18. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V .............................................. 34
3.19. ADC Temperature sensor readout ......................................................................................................... 35
3.20. OPAMP Common Mode Rejection Ratio ................................................................................................. 38
3.21. OPAMP Positive Power Supply Rejection Ratio ........................................................................................ 39
3.22. OPAMP Negative Power Supply Rejection Ratio ...................................................................................... 39
3.23. OPAMP Voltage Noise Spectral Density (Unity Gain) V
=1V ..................................................................... 39
out
3.24. OPAMP Voltage Noise Spectral Density (Non-Unity Gain) .......................................................................... 40
3.25. Typical ACMP Characteristics ............................................................................................................... 41
4.1. EFM32TG110 Pinout (top view, not to scale) .............................................................................................. 44
4.2. QFN24 (Preliminary) .............................................................................................................................. 48
6.1. Example Chip Marking ........................................................................................................................... 51
www.energymicro.com
2011-07-26 - d0013_Rev0.92
57

Related parts for EFM32TG110F32-QFN24