TJA1051T/3 NXP Semiconductors, TJA1051T/3 Datasheet - Page 17

• Manufacturer Part Number: TJA1051T/3
• Manufacturer: NXP Semiconductors

Specifications of TJA1051T/3

• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
17. Soldering of HVSON packages
TJA1051
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Section 16
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can found in the following application notes:
Fig 9.
•
•
AN10365 ‘Surface mount reflow soldering description”
AN10366 “HVQFN application information”
temperature
Temperature profiles for large and small components
MSL: Moisture Sensitivity Level
contains a brief introduction to the techniques most commonly used to solder
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 25 March 2011
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
High-speed CAN transceiver
temperature
peak
TJA1051
© NXP B.V. 2011. All rights reserved.
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time
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