SC16C554BIB64,157 NXP Semiconductors, SC16C554BIB64,157 Datasheet - Page 53
![IC UART QUAD SOT314-2](/photos/6/98/69856/568-64-lqfp_sot314-2_sml.jpg)
SC16C554BIB64,157
Manufacturer Part Number
SC16C554BIB64,157
Description
IC UART QUAD SOT314-2
Manufacturer
NXP Semiconductors
Datasheet
1.SC16C554BIB80528.pdf
(58 pages)
Specifications of SC16C554BIB64,157
Number Of Channels
4, QUART
Fifo's
16 Byte
Voltage - Supply
2.5V, 3.3V, 5V
With Auto Flow Control
Yes
With False Start Bit Detection
Yes
With Modem Control
Yes
With Cmos
Yes
Mounting Type
Surface Mount
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935274932157
SC16C554BIB64
SC16C554BIB64
SC16C554BIB64
SC16C554BIB64
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SC16C554BIB64,157
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
SC16C554B_554DB
Product data sheet
12.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 27.
Table 28.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 27
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
28
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs
35.
Rev. 4 — 8 June 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
SC16C554B/554DB
35) than a SnPb process, thus
≥ 350
220
220
245
> 2000
260
245
© NXP B.V. 2010. All rights reserved.
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