ARF1519 MICROSEMI, ARF1519 Datasheet - Page 4

• Manufacturer Part Number: ARF1519
• Manufacturer: MICROSEMI

Specifications of ARF1519

• Lead Free Status / Rohs Status: Compliant

Thermal Considerations and Package
Mounting:
available when the package mounting surface is
at 25°C and the junction temperature is 200°C.
The thermal resistance between junctions and
case mounting surface is 0.12°C/W. When instal-
led, an additional thermal impedance of 0.1°C/W
between the package base and the mounting sur-
face is typical. Insure that the mounting surface
is smooth and flat. Thermal joint compound
must be used to reduce the effects of small sur-
face irregularities. The heatsink should incorpo-
rate a copper heat spreader to obtain best re-
sults. Use 4-40 or M3 screws torqued to 1.2 Nm.
The ceramic portion of the device between
leads and mounting surface is beryllium oxide-
BeO. Beryllium oxide dust is toxic when in-
haled. Care must be taken during handling
and mounting to avoid damage to this area
These devices must never be thrown away
with general industrial or domestic waste.
The rated 1350W power dissipation is only
HAZARDOUS MATERIAL WARNING
RF
Input
C7
J1
T1
C9
C1
ARF1519 -- 13.56 MHz Test Circuit
13.56 MHz Test Amp
ARF1519
C2
T1
L1
DUT
L2
L3
C3
C4
.250
C8
.125d
R1
.250
C5
C10
BeO
C6
ARF1519
Output
200V
.466
1.250
1525-100
Parts placement - Not to Scale.
1.500
C1-C3 1nF X7R 100V smt
C4 2x 8.2 nF 1kV COG
C5 270pF x2 ATC 100C
C7-C10 8.2 nF 1kv COG
C11 390 + 27 pF ATC 100C
L1 2uH - 22t #24 enam. .312" dia.
L2 368 nH - 5t #12 .625" dia .5" l
L3 500nH 2t on 850u .5" bead
R1 2.2k 0.5W
T1 10:1t transformer
.150r
.300
RF 12-04
.750
.200
.500
.005 .040
.500
1.000
J2
2
G
1 Drain
2 Source
3 Source
4 Gate
4
1
D
S
3