MMA1200KEG Freescale Semiconductor, MMA1200KEG Datasheet - Page 7

• Manufacturer Part Number: MMA1200KEG
• Manufacturer: Freescale Semiconductor

Specifications of MMA1200KEG

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Sensors
Freescale Semiconductor
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Figure 7. Footprint SOIC-16 (Case 475-01)
0.080 in.
2.03 mm
0.380 in.
9.65 mm
footprint, the packages will self-align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.050 in.
1.27 mm
0.024 in.
0.610 mm
MMA1200KEG
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