LTC6994CS6-2#PBF Linear Technology, LTC6994CS6-2#PBF Datasheet - Page 20

• Manufacturer Part Number: LTC6994CS6-2#PBF
• Manufacturer: Linear Technology

Specifications of LTC6994CS6-2#PBF

• Lead Free Status / Rohs Status: Compliant

LTC6994-1/LTC6994-2
applicaTions inForMaTion
Supply Bypassing and PCB Layout Guidelines
The LTC6994 is an accurate monostable multivibrator when
used in the appropriate manner. The part is simple to use
and by following a few rules, the expected performance is
easily achieved. Adequate supply bypassing and proper
PCB layout are important to ensure this.
Figure 16 shows example PCB layouts for both the SOT-23
and DCB packages using 0603 sized passive components.
The layouts assume a two layer board with a ground plane
layer beneath and around the LTC6994. These layouts are
a guide and need not be followed exactly.
1. Connect the bypass capacitor, C1, directly to the V
20
that, C1’s GND connection can be accomplished through
multiple vias to the ground plane. Multiple vias for both
the GND pin connection to the ground plane and the
GND pins using a low inductance path. The connection
from C1 to the V
layer. For the DCB package, C1’s connection to GND is
also simply done on the top layer. For the SOT-23, OUT
can be routed through the C1 pads to allow a good C1
GND connection. If the PCB design rules do not allow
C1 connection to the ground plane are recommended
to minimize the inductance. Capacitor C1 should be a
0.1µF ceramic capacitor.
+
pin is easily done directly on the top
R2
R1
SET
DIV
V
V
+
+
R
C1
SET
DCB PACKAGE
Figure 16. Supply Bypassing and PCB Layout
GND
OUT
IN
R
SET
+
and
IN
GND
SET
LTC6994
OUT
2. Place all passive components on the top side of the
3. Place R
4. Connect R
5. Use a ground trace to shield the SET pin. This provides
6. Place R1 and R2 close to the DIV pin. A direct, short
DIV
V
+
board. This minimizes trace inductance.
a direct, short connection. The SET pin is a current sum-
ming node and currents injected into this pin directly
modulate the output delay. Having a short connection
minimizes the exposure to signal pickup.
or vias to the ground plane will not have a significant
affect on accuracy, but a direct, short connection is
recommended and easy to apply.
another layer of protection from radiated signals.
connection to the DIV pin minimizes the external signal
coupling.
C1
0.1µF
SET
GND
R
SET
IN
SET
TSOT-23 PACKAGE
SET
as close as possible to the SET pin and make
R1
R2
directly to the GND pin. Using a long path
V
+
R2
OUT
DIV
C1
V
+
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R1
V
+
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