TDA8922CTH/N1,118 NXP Semiconductors, TDA8922CTH/N1,118 Datasheet - Page 38

• Manufacturer Part Number: TDA8922CTH/N1,118
• Description: IC AMP AUDIO CLASS D 24HSOP
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDA8922CTH/N1,118

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 155W x 1 @ 8 Ohm; 75W x 2 @ 6 Ohm
• Voltage - Supply: ±12.5 V ~ 32.5 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Package / Case: 24-HSOP
• Operational Class: Class-D
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.02@8Ohm@1W%
• Single Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Dual
• Rail/rail I/o Type: No
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): ±12.5V
• Mounting: Surface Mount
• Pin Count: 24
• Package Type: HSOP
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS compliant by exemption
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free by exemption / RoHS compliant by exemption
• Other names: 935286885118

NXP Semiconductors
17. Revision history
Table 15.
TDA8922C_1
Product data sheet
Document ID
TDA8922C_1
Revision history
16.4 Package related soldering information
Table 14.
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
Release date
20090907
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Data sheet status
Product data sheet
Rev. 01 — 7 September 2009
Soldering method
Dipping
-
suitable
-
Change notice
-
2
75 W class-D power amplifier
Supersedes
-
Wave
suitable
suitable
not suitable
TDA8922C
© NXP B.V. 2009. All rights reserved.
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