MCM69R736CZP5 Freescale Semiconductor, Inc, MCM69R736CZP5 Datasheet

no-image

MCM69R736CZP5

Manufacturer Part Number
MCM69R736CZP5
Description
Manufacturer
Freescale Semiconductor, Inc
Datasheet
4M Late Write HSTL
designed to provide high performance in secondary cache and ATM switch,
Telecom, and other high speed memory applications. The MCM69R818C
(organized as 256K words by 18 bits) and the MCM69R736C (organized as 128K
words by 36 bits) are fabricated in Motorola’s high performance silicon gate
BiCMOS technology.
the RAM. At the rising edge of CK, all addresses, write enables, and synchronous
selects are registered. An internal buffer and special logic enable the memory to
accept write data on the rising edge of CK, a cycle after address and control sig-
nals. Read data is also driven on the rising edge of CK.
(V ref ) and output voltage (V DDQ ) gives the system designer greater flexibility in
optimizing system performance.
the entire word.
match the impedance of the circuit traces which reduces signal reflections.
REV 1
8/10/99
MOTOROLA FAST SRAM
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1999
The MCM69R736C/818C is a 4M–bit synchronous late write fast static RAM
The differential clock (CK) inputs control the timing of read/write operations of
The RAM uses HSTL inputs and outputs. The adjustable input trip–point
The synchronous write and byte enables allow writing to individual bytes or
The impedance of the output buffers is programmable, allowing the outputs to
Byte Write Control
Single 3.3 V +10%, –5% Operation
HSTL — I/O (JEDEC Standard JESD8–6 Class I Compatible)
HSTL — User Selectable Input Trip–Point
HSTL — Compatible Programmable Impedance Output Drivers
Register to Register Synchronous Operation
Asynchronous Output Enable
Boundary Scan (JTAG) IEEE 1149.1 Compatible
Differential Clock Inputs
Optional x18 or x36 Organization
MCM69R736C/818C–4 = 4 ns
MCM69R736C/818C–4.4 = 4.4 ns
MCM69R736C/818C–5 = 5 ns
MCM69R736C/818C–6 = 6 ns
Sleep Mode Operation (ZZ pin)
119–Bump, 50 mil (1.27 mm) Pitch, 14 mm x 22 mm Plastic Ball Grid Array
(PBGA) Package
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
MCM69R736C
MCM69R818C
MCM69R736C MCM69R818C
Order this document
by MCM69R736C/D
ZP PACKAGE
CASE 999–02
PBGA
1

Related parts for MCM69R736CZP5

MCM69R736CZP5 Summary of contents

Page 1

... Freescale Semiconductor, Inc. MOTOROLA SEMICONDUCTOR TECHNICAL DATA 4M Late Write HSTL The MCM69R736C/818C is a 4M–bit synchronous late write fast static RAM designed to provide high performance in secondary cache and ATM switch, Telecom, and other high speed memory applications. The MCM69R818C (organized as 256K words by 18 bits) and the MCM69R736C (organized as 128K words by 36 bits) are fabricated in Motorola’ ...

Page 2

... Freescale Semiconductor, Inc. ADDRESS SA REGISTERS SW SW REGISTERS SBx REGISTERS MCM69R736C DDQ DQc DQc DQc DQc DDQ DQc DQc DQc SBc NC SBb H DQc DQc DDQ ref ref K DQd DQd DQd DQd SBd CK SBa M V DDQ DQd DQd DQd DQd DQd DDQ TMS ...

Page 3

... Freescale Semiconductor, Inc. MCM69R736C PIN DESCRIPTIONS PBGA Pin Locations 4K 4L (a) 6K, 7K, 6L, 7L, 6M, 6N, 7N, 6P, 7P (b) 6D, 7D, 6E, 7E, 6F, 6G, 7G, 6H, 7H (c) 1D, 2D, 1E, 2E, 2F, 1G, 2G, 1H, 2H (d) 1K, 2K, 1L, 2L, 2M, 1N, 2N, 1P 2A, 3A, 5A, 6A, 3B, 5B, 2C, 3C, 5C, 6C, 4N, 4P, 2R, 6R, 3T, 4T, 5T 5L, 5G, 3G, 3L (a), (b), (c), (d) ...

Page 4

... Freescale Semiconductor, Inc. MCM69R818C PIN DESCRIPTIONS PBGA Pin Locations 4K 4L (a) 6D, 7E, 6F, 7G, 6H, 7K, 6L, 6N, 7P (b) 1D, 2E, 2G, 1H, 2K, 1L, 2M, 1N 2A, 3A, 5A, 6A, 3B, 5B, 2C, 3C, 5C, 6C, 4N, 4P, 2R, 6R, 2T, 3T, 5T, 6T 5L, 3G (a), ( 4C, 2J, 4J, 6J, 4R, 5R 1A, 7A, 1F, 7F, 1J, 7J, 1M, 7M, 1U, 7U 3J, 5J 3D, 5D, 3E, 5E, 3F, 5F, 5G, 3H, 5H, 3K, ...

Page 5

... Freescale Semiconductor, Inc. ABSOLUTE MAXIMUM RATINGS (Voltages Referenced See Note) Rating Core Supply Voltage Output Supply Voltage Voltage On Any Pin Input Current (per I/O) Output Current (per I/O) Operating Temperature Temperature Under Bias Storage Temperature NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded ...

Page 6

... Freescale Semiconductor, Inc. DC OPERATING CONDITIONS AND CHARACTERISTICS ( 3 10%, – 5 RECOMMENDED OPERATING CONDITIONS Parameter Symbol Core Power Supply Voltage Output Driver Supply Voltage Active Power Supply Current (Device Selected, All Outputs Open, Freq = Max Max, V DDQ = Max). Includes Supply Currents for Quiescent Active Power Supply Current (Device Selected, All Outputs Open, Freq = Max, V DDQ = Max) ...

Page 7

... Freescale Semiconductor, Inc. DC OUTPUT BUFFER CHARACTERISTICS — PROGRAMMABLE IMPEDANCE PUSH–PULL OUTPUT BUFFER MODE ( 3 DDQ = 1 See Notes 1 and 2) Parameter Output Logic Low Output Logic High Light Load Output Logic Low Light Load Output Logic High NOTES: 1. The impedance controlled mode is expected to be used in point–to–point applications, driving high–impedance inputs. ...

Page 8

... Freescale Semiconductor, Inc. AC OPERATING CONDITIONS AND CHARACTERISTICS ( 3 10%, – 5 Input Pulse Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . . . Input Timing Measurement Reference Level . . . . . . . . . . . . . . Output Timing Reference Level . . . . . . . . . . . . . . . . . . . . . . . . . READ/WRITE CYCLE TIMING Parameter Symbol Cycle Time t KHKH Clock High Pulse Width t KHKL Clock Low Pulse Width t KLKH Clock High to Output Low– ...

Page 9

... Freescale Semiconductor, Inc. AC INPUT CHARACTERISTICS (See Note 1) Parameter AC Input Logic High (See Figure 4) AC Input Logic Low (See Figures 2 and 4) Input Reference Peak–to–Peak AC Voltage Clock Input Differential Voltage NOTES: 1. Inputs may overshoot 1.5 V (peak) for up to 35% t KHKH (e.g., 1 clock cycle time of 4.4 ns). See Figure 2. ...

Page 10

... Freescale Semiconductor, Inc. REGISTER/REGISTER READ–WRITE–READ CYCLES t KHKH CK t AVKH t KHAX SVKH SS SW SBx KHQV DQx Q–1 For More Information On This Product, MCM69R736C MCM69R818C 10 t KHKL t KLKH KHSX t WVKH t KHWX t KHQX1 t KHQZ t KHQX t KHQX t DVKH to: www.freescale.com A4 t KHDX Q3 MOTOROLA FAST SRAM ...

Page 11

... Freescale Semiconductor, Inc. REGISTER/REGISTER READ–WRITE–READ t KHKH CK t AVKH t KHAX SBx G DQx Q–1 For More Information On This Product, MOTOROLA FAST SRAM (G Controlled) t KHKL t KLKH GHQZ t GLQX to: www.freescale.com A4 t GLQV t GHQX Q3 MCM69R736C MCM69R818C 11 ...

Page 12

... Freescale Semiconductor, Inc. É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É ...

Page 13

... Freescale Semiconductor, Inc. FUNCTIONAL OPERATION READ AND WRITE OPERATIONS All control signals except G are registered on the rising edge of the CK clock. These signals must meet the setup and hold times shown in the AC Characteristics table. On the rising edge of the following clock, read data is clocked into the output register and available at the outputs at t KHQV ...

Page 14

... Freescale Semiconductor, Inc. SLEEP MODE This device is equipped with an optional sleep or low power mode. The sleep mode pin is asynchronous and active high. During normal operation, the ZZ pin is pulled low. When ZZ is pulled high, the chip will enter sleep mode where the device will meet the lowest possible power conditions. ...

Page 15

... Freescale Semiconductor, Inc. TAP AC OPERATING CONDITIONS AND CHARACTERISTICS ( 3 10%, – 5 Input Pulse Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . . . Input Timing Measurement Reference Level . . . . . . . . . . . . . . . Output Timing Reference Level . . . . . . . . . . . . . . . . . . . . . . . . . . TAP CONTROLLER TIMING Parameter Cycle Time Clock High Time Clock Low Time TMS Setup TMS Hold TDI Valid to TCK High TCK High to TDI Don’ ...

Page 16

... Freescale Semiconductor, Inc. TEST ACCESS PORT PINS TCK — TEST CLOCK (INPUT) Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the falling edge of TCK. TMS — TEST MODE SELECT (INPUT) The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state machine ...

Page 17

... Freescale Semiconductor, Inc. MCM69R736C Bump/Bit Scan Order Bit Signal Bump Bit Signal No. Name ID No DQa DQa DQa DQa DQa DQa DQa DQa DQa SBa SBb DQb DQb DQb DQb DQb DQb DQb DQb DQb NOTES: 1. The NC pads listed in this table are indeed no connects, but are represented in the boundary scan register by a “place holder” bit that is forced to logic 1 ...

Page 18

... Freescale Semiconductor, Inc. TAP CONTROLLER INSTRUCTION SET OVERVIEW There are two classes of instructions defined in IEEE Stan- dard 1149.1–1990; the standard (public) instructions and device specific (private) instructions. Some public instruc- tions, are mandatory for IEEE 1149.1 compliance. Optional public instructions must be implemented in prescribed ways. ...

Page 19

... Freescale Semiconductor, Inc. STANDARD (PUBLIC) INSTRUCTION CODES Instruction Code* EXTEST 000 Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces all DQ pins IDCODE 001** Preloads ID register and places it between TDI and TDO. Does not affect RAM operation. ...

Page 20

... For More Information On This Product, MCM69R736C MCM69R818C 20 ORDERING INFORMATION (Order by Full Part Number) 69R736C MCM 69R818C Tape and Reel, Blank = Tray Speed ( ns, 4.4 = 4.4 ns ns, Package (ZP = PBGA) MCM69R818CZP4 MCM69R736CZP4R MCM69R818CZP4.4 MCM69R736CZP4.4R MCM69R818CZP5 MCM69R736CZP5R MCM69R818CZP6 MCM69R736CZP6R PACKAGE DIMENSIONS ZP PACKAGE BUMP PBGA CASE 999–02 b 119X 0 0. ...

Related keywords