CA3252M Intersil Corporation, CA3252M Datasheet

CA3252M

Manufacturer Part Number

CA3252M

Description

Manufacturer

Intersil Corporation

Datasheet

1.CA3252M.pdf (6 pages)

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CA3252M

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CA3252M

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Download datasheet (62Kb)

March 1998

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

http://www.intersil.com or 407-727-9207

Features

• Four 600mA Non-Inverting Power Output Drivers

• 50V and 1A Maximum Rated Power Output Drivers

• V

• Inputs Compatible With TTL or 5V CMOS Logic

• Suitable For Resistive, Lamp or Inductive Loads

• Inductive Clamps on Each Output

• High Dissipation Power-Frame Package

• Operating Temperature Ranges . . . . . . -40

Applications

• Solenoids

• Relays

• Lamps

• Steppers

• Small Motors

• Displays

System Applications

• Automotive

• Appliances

• Industrial Controls

• Robotics

Pinouts

CE(SUS)

CLAMP AB

CLAMP CD

Capability . . . . . . . . . . . . . . . . . . . . . . . . . 35V

OUT A

OUT B

OUT C

OUT D

GND

TOP VIEW

CA3252E

(PDIP)

Intersil Corporation 1999

IN A

IN B

ENABLE

GND

IN C

IN D

C to 105

Quad Gated Non-Inverting Power Driver

Description

The CA3252 is used to interface low-level logic to high cur-

rent loads. Each Power Driver has four inverting switches

consisting of an inverting logic input stage and an inverting

low-side driver output stage. All inputs are 5V TTL/CMOS

logic compatible and have a common Enable input. On-chip

steering diodes are connected from each output (in pairs) to

the CLAMP pins (in pairs) which may be used in conjunction

with external zener diodes to protect the IC against over-volt-

age transients that result from inductive load switching. The

CA3252 may be used in a variety of automotive and indus-

trial control applications to drive relays, solenoids, lamps and

small motors.

To allow for maximum heat transfer from the chip, all ground

pins on the DIP and SOIC packages are directly connected

to the mounting pad of the chip. Integral heat spreading lead

frames directly connect the bond pad and ground leads for

good heat dissipation. In a typical application, the package is

mounted on a copper PC Board. By increasing copper

ground area on the PC Board, more heat is conducted away

from the ground leads. The junction-to-ambient thermal

resistances may be reduced to less than 40

approximately two square inches of copper area.

Ordering Information

CA3252E

CA3252M

NUMBER

PART

CLAMP AB

CLAMP CD

OUT B

OUT C

GND

TEMP. (

-40 to 105

CA3252

TOP VIEW

CA3252M

(SOIC)

16 Ld PDIP

20 Ld SOIC

PACKAGE

File Number

OUT A

IN A

INB

ENABLE

GND

IN C

IN D

OUT D

E16.3

M20.3

PKG. NO.

C/W with

1542.2

Related parts for CA3252M

CA3252M Summary of contents

Page 1

... CLAMP ENABLE 13 GND 12 GND CLAMP CD © Intersil Corporation 1999 1 CA3252 o C/W with o TEMP PACKAGE PKG. NO. -40 to 105 16 Ld PDIP E16.3 -40 to 105 20 Ld SOIC M20.3 CA3252M (SOIC) TOP VIEW 1 20 OUT INB OUT ENABLE GND 5 16 GND GND 6 15 GND OUT ...

Page 2

Functional Block Diagram ENABLE GND ENABLE TRUTH TABLE (Each Output) ENABLE IN OUT High Low ...

Page 3

ENABLE FIGURE 2. SCHEMATIC OF ONE INPUT SECTION +5V 12k 0.001 ENABLE GND FIGURE 3. TYPICAL LATCHED ON CIRCUIT SWITCHING CONFIGURATION. WHEN V TURNED ON (LOW). CA3252 V CC CONSTANT CURRENT SOURCE REFERENCE VOLTAGE IN 11k ...

Page 4

... Low Enable Voltage Low Enable Current High Enable Voltage High Enable Current CA3252 Thermal Information Thermal Resistance (Typical, Note 2) DC CA3252E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CA3252M Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 DC Maximum Storage Temperature Range . . . . . . . . . .-65 DC Maximum Lead Temperature Soldering (10s Max 300 (SOIC - Lead Tips Only ...

Page 5

Dual-In-Line Plastic Packages (PDIP INDEX N/2 AREA -B- -A- D BASE PLANE -C- SEATING PLANE 0.010 (0.25 NOTES: 1. Controlling Dimensions: INCH. In case ...

Page 6

... All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiﬁcation. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli- able. However, no responsibility is assumed by Intersil or its subsidiaries for its use ...

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