SA56202TW NXP Semiconductors, SA56202TW Datasheet
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SA56202TW
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SA56202TW Summary of contents
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SA56202 One-chip motor driver Rev. 01 — 19 July 2004 1. General description The SA56202 is a one-chip motor driver IC that is capable to drive all motors DVD systems: spindle, sled and loading motors and actuators ...
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... Philips Semiconductors 4. Ordering information Table 1: Ordering information Type number Package Name SA56202TW HTSSOP56 plastic thermal enhanced thin shrink small outline package; 56 leads; 9397 750 12772 Preliminary data sheet Description body width 6.1 mm; exposed die pad Rev. 01 — 19 July 2004 SA56202 One-chip motor driver ...
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Philips Semiconductors 5. Block diagram Fig 1. Block diagram. 9397 750 12772 Preliminary data sheet 1 HU REVERSE 2 DETECTION HALL 4 AMP HBIAS HALL BIAS 8 RREF 9 CURRENT REMF ...
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... Preliminary data sheet HBIAS RREF 8 9 REMF 10 RLIM V 11 SS1(SPN DD1(SPN SA56202TW V 15 SS2(SPN DD2(SPN SSD 20 VINSPN 21 VINREF V 22 DDA 23 CP1 CP2 24 25 CP3 CTL1 26 CTL2 27 28 ...
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Philips Semiconductors Table 2: Symbol REMF RLIM V SS1(SPN DD1(SPN SS2(SPN DD2(SPN SSD VINSPN VINREF V DDA CP1 CP2 CP3 CTL1 CTL2 TEMP VINSLD1 VINSLD2 V SSA V DD(SLD) SLD2O SLDO2+ RSLD2 ...
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Philips Semiconductors Table 2: Symbol VINTLT VINTRK VINFCS VINLD V SS(DIO) DIODE COSC 7. Functional description 7.1 Spindle motor control The control input voltage on pin VINSPN is converted into a digital value by the ADC where the voltage on ...
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Philips Semiconductors driver do not use this recuperated current, than the supply voltage can possibly rise to unacceptable values. In that case it is recommended to lower the spindle current during brake by means of the VINSPN setting. Upon detection ...
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Philips Semiconductors Figure 6 back-EMF voltage is part of these motor voltages. Fig 6. Motor voltages when accelerating and braking with constant motor current. 7.3 Sine generation using True-Silent signals For the phase relation between the Hall inputs and the ...
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Philips Semiconductors Fig 7. Phase relation between Hall input signals and spindle motor driver output 7.4 Programming R If the supply is connected between the terminals of a non-running spindle motor, then usually a current will flow ...
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Philips Semiconductors I can be chosen fraction of this maximum current I LIM between R is programmed as expressed in the following formula choosing I Figure 8 Fig 8. Limit current I During accelerating and ...
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Philips Semiconductors where N for easy interfacing and 5 V logic. 7.7 Sled motor driver Two current-steering PWM channels are available to drive a stepper motor. Per channel an external sense resistor R control loop is implemented ...
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Philips Semiconductors 7.8 Loading motor driver One of the linear channels is available to drive a DC loading motor. Pin V set the supply voltage for the loading motor driver. bridge topology of the SA56202. Fig 11. Voltage-steering bridge topology ...
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Philips Semiconductors 7.12 Oscillator The RC oscillator uses two external components (R 18 MHz. R charge and discharge tolerance) and C REF The oscillator can be overruled by applying an 18 MHz clock ...
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Philips Semiconductors Table 4: In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol I STEER I DIODE I OSC General T stg T amb T j Electrostatic discharge voltage V esd(HBM) V esd(MM) [1] Class 1, equivalent to ...
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Philips Semiconductors 10. Characteristics Table 6: Characteristics amb DDA DD(SPN) Symbol Parameter Spindle motor driver V system supply voltage DDA V motor supply voltage DD(SPN) V input offset voltage Hall amplifier ...
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Philips Semiconductors Table 6: Characteristics …continued amb DDA DD(SPN) Symbol Parameter R D-MOSFET on-resistance (high or ds(on) low) General V charge pump output voltage CP3 V HIGH-level input voltage digital on ...
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Philips Semiconductors 11. Application information 5V 150 HALL U HALL V HALL spindle motor 3.3 V spindle input SELECT 3.3 V Fig 13. Application diagram. 9397 750 12772 Preliminary ...
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Philips Semiconductors 12. Package outline HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT A A ...
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Philips Semiconductors 13. Soldering 13.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 14. Revision history Table 8: Revision history Document ID Release date SA56202_1 20040719 9397 750 12772 Preliminary data sheet Data sheet status Change notice Preliminary data sheet - Rev. 01 — 19 July 2004 SA56202 One-chip motor driver ...
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Philips Semiconductors 15. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...