ISP1107W NXP Semiconductors, ISP1107W Datasheet

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ISP1107W

Manufacturer Part Number
ISP1107W
Description
Manufacturer
NXP Semiconductors
Datasheet
1. General description
2. Features
The ISP1105/1106/1107 range of Universal Serial Bus (USB) transceivers are fully
compliant with the Universal Serial Bus Specification Rev. 1.1 . They are ideal for
portable electronics devices such as mobile phones, digital still cameras, Personal
Digital Assistants (PDA) and Information Appliances (IA).
They allow USB Application Specific ICs (ASICs) and Programmable Logic Devices
(PLDs) with power supply voltages from 1.65 V to 3.6 V to interface with the physical
layer of the Universal Serial Bus. They have an integrated 5 V to 3.3 V voltage
regulator for direct powering via the USB supply V
The ISP1105/1106/1107 range can be used as a USB device transceiver or a USB
host transceiver. They can transmit and receive serial data at both full-speed
(12 Mbit/s) and low-speed (1.5 Mbit/s) data rates.
ISP1105 allows single/differential input modes selectable by a MODE input and it is
available in HBCC16 package. ISP1106 allows only differential input mode and is
available in both TSSOP16 and HBCC16 packages. ISP1107 allows only
single-ended input mode and is available in both TSSOP16 and HBCC16 packages.
ISP1105/1106/1107
Advanced Universal Serial Bus transceivers
Rev. 06 — 30 November 2001
Complies with Universal Serial Bus Specification Rev. 1.1
Integrated bypassable 5 V to 3.3 V voltage regulator for powering via USB V
V
Used as a USB device transceiver or a USB host transceiver
Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) serial data rates
Stable RCV output during SE0 condition
Two single-ended receivers with hysteresis
Low-power operation
Supports an I/O voltage range from 1.65 V to 3.6 V
4 kV on-chip ESD protection
Full industrial operating temperature range 40 to 85 C
Available in small TSSOP16 (except ISP1105) and HBCC16 packages.
BUS
disconnection indication through VP and VM
BUS
.
Product data
BUS

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ISP1107W Summary of contents

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ISP1105/1106/1107 Advanced Universal Serial Bus transceivers Rev. 06 — 30 November 2001 1. General description The ISP1105/1106/1107 range of Universal Serial Bus (USB) transceivers are fully compliant with the Universal Serial Bus Specification Rev. 1.1 . They are ideal for ...

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... Type number Package Name Description [1] ISP1105W HBCC16 plastic, heatsink bottom chip carrier; 16 terminals; body 3 ISP1106W ISP1107W ISP1106DH TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm ISP1107DH [1] The ground terminal of ISP1105W is connected to the exposed diepad (heatsink). 4.1 Ordering options Table 2: Selection guide ...

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Philips Semiconductors 5. Functional diagram (1) Use a 39 (2) Connect to D for low-speed operation. (3) Pin function depends on device type see (4) Only for ISP1105. Fig 1. Functional diagram (combined ISP1105, ISP1106 and ISP1107). 9397 750 08872 ...

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... D 9 SUSPND VPO/VO VP VMO/FSE0 12 RCV V reg(3. Bottom view MBL303 The asterisk (*) denotes that the signal names VO and FSE0 apply to the ISP1107W. Fig 3. Pinning diagram HBCC16 (ISP1106 and ISP1107). V pu(3.3) V CC(5. reg(3.3) SOFTCON VMO/FSE0 RCV 4 13 VPO/VO ...

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Philips Semiconductors 6.2 Pin description Table 3: Pin description [1] Symbol Pin ISP1105 ISP1106/7 HBCC16 HBCC16 RCV SUSPND 5 5 MODE 6 [2] GND - ...

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Philips Semiconductors Table 3: Pin description …continued [1] Symbol Pin ISP1105 ISP1106/7 HBCC16 HBCC16 reg(3. CC(5. pu(3.3) SOFTCON 16 16 [1] Symbol names with an overscore (e.g. NAME) indicate active LOW ...

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Philips Semiconductors 7.2 Operating functions Table 5: FSE0 Table 6: VMO Table 7: [ indicates the sharing mode (V [2] RCV* denotes the signal level on output RCV just before SE0 state occurs. This level ...

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Philips Semiconductors low-power (suspended) state level. Both the VP and VM pins are driven HIGH to indicate this mode. Pin RCV is made LOW. Some hysteresis is built into the detection of V reg(3.3) Table 8: Pins V CC(5.0) V ...

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Philips Semiconductors Table 10: Input option Internal regulator Regulator bypass 8. Limiting values Table 11: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC(5.0) V I/O supply voltage CC(I/O) V ...

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Philips Semiconductors 9. Static characteristics Table 13: Static characteristics: supply pins V = 4 3 reg(3.3) combinations unless otherwise specified. amb Symbol Parameter ...

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Philips Semiconductors Table 14: Static characteristics: digital pins V = 1. CC(I/O) GND Symbol Parameter V = 1.65 to 3.6 V CC(I/O) Input levels V LOW-level input voltage IL V HIGH-level input ...

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Philips Semiconductors Table 15: Static characteristics: analog I/O pins ( 4 3 reg(3.3) Symbol Parameter Input levels Differential receiver V differential input sensitivity DI ...

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Philips Semiconductors 10. Dynamic characteristics Table 16: Dynamic characteristics: analog I/O pins ( 4 3 reg(3.3) combinations unless ...

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Philips Semiconductors Table 16: Dynamic characteristics: analog I/O pins ( 4 3 reg(3.3) combinations unless otherwise specified. amb ...

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Philips Semiconductors 11. Test information for (1) Complies with USB 1.1. For USB 2.0 a resistor of 39 Fig 9. Load for enable and disable times. Fig 10. Load for VM, VP ...

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Philips Semiconductors 12. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 0.65 mm terminal 1 index area 1 1 DIMENSIONS (mm are the ...

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Philips Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 ...

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Philips Semiconductors 13. Packaging The ISP1105/1106/1107W (HBCC16 package) is delivered on a Type A carrier tape, see Figure The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking ...

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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

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Philips Semiconductors During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. ...

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Philips Semiconductors 15. Additional soldering information 15.1 (H)BCC packages: footprint The surface material of the terminals on the resin protrusion consists of a 4-layer metal structure (Au, Pd, Ni and Pd). The layer (0.1 m min.) ensures ...

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Philips Semiconductors 16. Revision history Table 19: Revision history Rev Date CPCN Description 06 20011130 - Product data; sixth version. Supersedes ISP1105_1106_1107- Sept 2001 (9397 750 08643). Modifications: • Changed the HBCC16 package version from SOT639-1 to SOT639-2 ...

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Philips Semiconductors 17. Data sheet status [1] [2] Data sheet status Product status Objective data Development Preliminary data Qualification Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product ...

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Philips Semiconductors Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . ...

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