ISP1107W NXP Semiconductors, ISP1107W Datasheet
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ISP1107W
Related parts for ISP1107W
ISP1107W Summary of contents
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ISP1105/1106/1107 Advanced Universal Serial Bus transceivers Rev. 06 — 30 November 2001 1. General description The ISP1105/1106/1107 range of Universal Serial Bus (USB) transceivers are fully compliant with the Universal Serial Bus Specification Rev. 1.1 . They are ideal for ...
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... Type number Package Name Description [1] ISP1105W HBCC16 plastic, heatsink bottom chip carrier; 16 terminals; body 3 ISP1106W ISP1107W ISP1106DH TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm ISP1107DH [1] The ground terminal of ISP1105W is connected to the exposed diepad (heatsink). 4.1 Ordering options Table 2: Selection guide ...
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Philips Semiconductors 5. Functional diagram (1) Use a 39 (2) Connect to D for low-speed operation. (3) Pin function depends on device type see (4) Only for ISP1105. Fig 1. Functional diagram (combined ISP1105, ISP1106 and ISP1107). 9397 750 08872 ...
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... D 9 SUSPND VPO/VO VP VMO/FSE0 12 RCV V reg(3. Bottom view MBL303 The asterisk (*) denotes that the signal names VO and FSE0 apply to the ISP1107W. Fig 3. Pinning diagram HBCC16 (ISP1106 and ISP1107). V pu(3.3) V CC(5. reg(3.3) SOFTCON VMO/FSE0 RCV 4 13 VPO/VO ...
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Philips Semiconductors 6.2 Pin description Table 3: Pin description [1] Symbol Pin ISP1105 ISP1106/7 HBCC16 HBCC16 RCV SUSPND 5 5 MODE 6 [2] GND - ...
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Philips Semiconductors Table 3: Pin description …continued [1] Symbol Pin ISP1105 ISP1106/7 HBCC16 HBCC16 reg(3. CC(5. pu(3.3) SOFTCON 16 16 [1] Symbol names with an overscore (e.g. NAME) indicate active LOW ...
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Philips Semiconductors 7.2 Operating functions Table 5: FSE0 Table 6: VMO Table 7: [ indicates the sharing mode (V [2] RCV* denotes the signal level on output RCV just before SE0 state occurs. This level ...
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Philips Semiconductors low-power (suspended) state level. Both the VP and VM pins are driven HIGH to indicate this mode. Pin RCV is made LOW. Some hysteresis is built into the detection of V reg(3.3) Table 8: Pins V CC(5.0) V ...
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Philips Semiconductors Table 10: Input option Internal regulator Regulator bypass 8. Limiting values Table 11: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC(5.0) V I/O supply voltage CC(I/O) V ...
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Philips Semiconductors 9. Static characteristics Table 13: Static characteristics: supply pins V = 4 3 reg(3.3) combinations unless otherwise specified. amb Symbol Parameter ...
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Philips Semiconductors Table 14: Static characteristics: digital pins V = 1. CC(I/O) GND Symbol Parameter V = 1.65 to 3.6 V CC(I/O) Input levels V LOW-level input voltage IL V HIGH-level input ...
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Philips Semiconductors Table 15: Static characteristics: analog I/O pins ( 4 3 reg(3.3) Symbol Parameter Input levels Differential receiver V differential input sensitivity DI ...
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Philips Semiconductors 10. Dynamic characteristics Table 16: Dynamic characteristics: analog I/O pins ( 4 3 reg(3.3) combinations unless ...
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Philips Semiconductors Table 16: Dynamic characteristics: analog I/O pins ( 4 3 reg(3.3) combinations unless otherwise specified. amb ...
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Philips Semiconductors 11. Test information for (1) Complies with USB 1.1. For USB 2.0 a resistor of 39 Fig 9. Load for enable and disable times. Fig 10. Load for VM, VP ...
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Philips Semiconductors 12. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 0.65 mm terminal 1 index area 1 1 DIMENSIONS (mm are the ...
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Philips Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 ...
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Philips Semiconductors 13. Packaging The ISP1105/1106/1107W (HBCC16 package) is delivered on a Type A carrier tape, see Figure The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking ...
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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. ...
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Philips Semiconductors 15. Additional soldering information 15.1 (H)BCC packages: footprint The surface material of the terminals on the resin protrusion consists of a 4-layer metal structure (Au, Pd, Ni and Pd). The layer (0.1 m min.) ensures ...
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Philips Semiconductors 16. Revision history Table 19: Revision history Rev Date CPCN Description 06 20011130 - Product data; sixth version. Supersedes ISP1105_1106_1107- Sept 2001 (9397 750 08643). Modifications: • Changed the HBCC16 package version from SOT639-1 to SOT639-2 ...
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Philips Semiconductors 17. Data sheet status [1] [2] Data sheet status Product status Objective data Development Preliminary data Qualification Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product ...
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Philips Semiconductors Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . ...