TDA8932T/N1,118 NXP Semiconductors, TDA8932T/N1,118 Datasheet - Page 28

• Manufacturer Part Number: TDA8932T/N1,118
• Description: IC AMP AUDIO 55W STER D 32SOIC
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDA8932T/N1,118

• Package / Case: 32-SOIC (7.5mm Width)
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 55W x 1 @ 8 Ohm; 26.5W x 2 @ 4 Ohm
• Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Product: Class-D
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935279642118; TDA8932T-T; TDA8932T-T

NXP Semiconductors
TDA8932_2
Preliminary data sheet
Equation 10
the thermal resistance from junction to ambient.
Where:
The power dissipation is shown in
The thermal resistance as a function of the PCB area (35 m copper) is shown in
Figure
Example 1
The required thermal resistance R
R
Fig 11. Thermal resistance as a function of the PCB area
•
•
th j a
R
T
T
P = power dissipation which is determined by the efficiency of the TDA8932
j(max)
amb
th(j-a)
At V
dissipation P = 2.3 W at P
T
(1) Single layer FR2 PCB; copper plane at device side (100 % coverage).
(2) Double layer FR4 PCB; copper plane on both sides (100 % coverage).
–
j(max)
11.
= ambient temperature
P
= maximum junction temperature
= thermal resistance from junction to ambient
=
= 30 V and P
= 125 C and T
T
----------------------------------- -
shows the relation between the maximum allowable power dissipation P and
j max
P
–
T
R
(K/W)
Rev. 02 — 12 December 2006
th(j-a)
amb
o
80
60
40
20
= 2
amb
0
o
= 25 C.
15 W into 8
= 15 W (see
2000
th(j-a)
Figure 20
4000
= 100 / 2.3 = 43 K/W.
Figure
(SE) and
(THD+N = 10 % continuous), the power
6000
20).
PCB area (mm
8000
Figure 27
001aae336
(1)
(2)
10000
2
Class-D audio amplifier
(BTL).
)
TDA8932
© NXP B.V. 2006. All rights reserved.
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