A82C250 NXP Semiconductors, A82C250 Datasheet
A82C250
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A82C250 Summary of contents
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... DATA SHEET PCA82C250 CAN controller interface Product specification Supersedes data of 1997 Oct 21 File under Integrated Circuits, IC18 INTEGRATED CIRCUITS 2000 Jan 13 ...
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... Jan 13 APPLICATIONS High-speed applications ( Mbaud) in cars. GENERAL DESCRIPTION The PCA82C250 is the interface between the CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. CONDITIONS ...
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... Jan PROTECTION 1 DRIVER 8 SLOPE/ STANDBY HS 4 RECEIVER 5 REFERENCE PCA82C250 VOLTAGE 2 GND Fig.1 Block diagram. handbook, halfpage 3 Product specification PCA82C250 7 CANH 6 CANL MKA669 TXD GND 2 7 CANH PCA82C250 3 CANL ref RXD MKA670 Fig.2 Pin configuration. ...
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... Philips Semiconductors CAN controller interface FUNCTIONAL DESCRIPTION The PCA82C250 is the interface between the CAN protocol controller and the physical bus primarily intended for high-speed applications ( Mbaud) in cars. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller fully compatible with the “ ...
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... According to “SNW-FQ-611 part E” . 2000 Jan 13 CONDITIONS 0 V < V < 5 time limit see Fig.8 note 1 note 2 note fixed value to be used for the calculation of T th(j-a) ) and ambient temperature (T d PARAMETER 5 Product specification PCA82C250 MIN. MAX. 0.3 +9.0 0 8.0 +18.0 150 +100 55 +150 40 +125 40 +150 ...
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... V; 1 not standby mode 0 < < 1 not standby mode see Fig 100 A 0. Product specification PCA82C250 TYP. MAX 100 170 0 0. +30 A 600 ...
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... standby mode < V < Product specification PCA82C250 MIN. TYP. MAX. 20 100 20 10 0.45V 0.55V CC CC 0.4V 0. 120 82 150 82 170 90 170 90 190 390 ...
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... Jan 100 TXD CANH PCA82C250 V ref CANL RXD Rs GND ext MKA671 Fig.3 Test circuit for dynamic characteristics. 0 onTXD t onRXD Fig.4 Timing diagram for dynamic characteristics. 8 Product specification PCA82C250 62 100 0 offTXD t offRXD MKA672 ...
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... Philips Semiconductors CAN controller interface handbook, full pagewidth V RXD handbook, full pagewidth V RXD 2000 Jan 13 hysteresis 0.5 V Fig.5 Hysteresis WAKE Fig.6 Timing diagram for wake-up from standby. 9 Product specification PCA82C250 HIGH LOW 0 diff MKA673 MKA674 ...
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... The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1” , test pulses and 3b. 2000 Jan 13 t dRXDL Fig.7 Timing diagram for bus dominant to RXD LOW CANH PCA82C250 CANL GND Rs R ext Fig.8 Test circuit for automotive transients. 10 Product specification PCA82C250 1 MKA675 SCHAFFNER GENERATOR MKA676 ...
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... CAN controller interface APPLICATION INFORMATION handbook, halfpage 2000 Jan 13 P8xC592/P8xCE598 CAN-CONTROLLER CTX0 CRX0 CRX1 PX,Y R ext TXD RXD V ref PCA82C250T CAN-TRANSCEIVER GND CANH CANL CAN BUS 124 124 LINE Fig.9 Application of the CAN transceiver. 11 Product specification PCA82C250 5 V 100 nF MKA677 ...
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... V 390 390 V DD 6N137 100 nF 390 TXD RXD V ref PCA82C250 CAN-TRANSCEIVER CANH CANL CAN BUS LINE Fig.10 Application with galvanic isolation. 12 Product specification PCA82C250 RX1 3.6 k 100 6N137 390 ext 100 nF GND 124 MKA678 ...
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... Philips Semiconductors CAN controller interface INTERNAL PIN CONFIGURATION handbook, full pagewidth TXD Rs RXD V ref 2000 Jan PCA82C250 5 2 GND Fig.11 Internal pin configuration. 13 Product specification PCA82C250 7 CANH CANL 6 MKA679 ...
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... Jan 13 PAD x 1 196 2 1280 3 1767 4 2588 5 2594 6 1689 7 948 8 196 7 6 PCA82C250U 2 3 2.79 mm Fig.12 Bonding pad locations. 14 Product specification PCA82C250 (1) COORDINATES y 135 135 135 135 1640 1640 1640 1640 5 4 MGL945 ...
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... scale ( 0.53 1.07 0.36 9.8 0.38 0.89 0.23 9.2 0.021 0.042 0.014 0.39 0.015 0.035 0.009 0.36 REFERENCES JEDEC EIAJ MO-001 SC-504 ( 6.48 3.60 8.25 2.54 7.62 6.20 3.05 7.80 0.26 0.14 0.32 0.10 0.30 0.24 0.12 0.31 EUROPEAN PROJECTION Product specification PCA82C250 SOT97-1 ( max. 10.0 0.254 1.15 8.3 0.39 0.01 0.045 0.33 ISSUE DATE 95-02-04 99-12-27 ...
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... REFERENCES JEDEC EIAJ MS-012 detail 1.0 0.7 1.05 0.25 0.25 0.4 0.6 0.039 0.028 0.041 0.01 0.01 0.016 0.024 EUROPEAN PROJECTION Product specification PCA82C250 SOT96 ( 0.7 0.1 0 0.028 0.004 0.012 ISSUE DATE 97-05-22 99-12-27 ...
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... Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds 300 C. When using a dedicated tool, all other leads can be soldered in one operation within seconds between 270 and 320 C. 17 Product specification PCA82C250 ...
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... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 Jan 13 PACKAGE suitable not suitable not suitable suitable not recommended not recommended 18 Product specification PCA82C250 SOLDERING METHOD (1) WAVE REFLOW DIPPING (2) suitable suitable (3) suitable suitable ...
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... Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die the responsibility of the customer to test and qualify their application in which the die is used. 2000 Jan 13 19 Product specification PCA82C250 ...
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Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + 101 ...