ISL59445IRZ Intersil, ISL59445IRZ Datasheet - Page 7

• Manufacturer Part Number: ISL59445IRZ
• Description: IC AMP TRIPLE MUX 1GHZ 32-QFN
• Manufacturer: Intersil

Specifications of ISL59445IRZ

• Applications: 4:1 Multiplexer-Amplifier
• Number Of Circuits: 3
• -3db Bandwidth: 1GHz
• Slew Rate: 1200 V/µs
• Current - Supply: 53mA
• Current - Output / Channel: 130mA
• Mounting Type: Surface Mount
• Package / Case: 32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Typical Performance Curves
FIGURE 17. INPUT NOISE vs FREQUENCY (OUTPUT A, B, C)
0
0
60
50
40
30
20
10
0
100
FIGURE 15. HIZ SWITCHING GLITCH V
HIZ
50Ω
TERM.
1K
FREQUENCY (Hz)
V
10ns/DIV
OUT
FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
7
A, B, C
10K
V
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
S
0
=
0
IN
JEDEC JESD51-3 AND SEMI G42-88 (SINGLE
LAYER) TEST BOARD
±
714mW
5V, R
V
= 0V
IN
= 0V
ISL59424, ISL59445
θ
JA
25
L
QFN24
100K
= 500Ω to GND, T
=140°C/W
AMBIENT TEMPERATURE (°C)
50
758mW
θ
75
JA
QFN32
=125°C/W
85
A
FIGURE 18. PACKAGE POWER DISSIPATION vs AMBIENT
= 25°C, unless otherwise specified. (Continued)
100
0
0
FIGURE 16. HIZ TRANSIENT RESPONSE V
HIZ
50Ω
TERM.
3.5
2.5
0.5
4
3
2
0
125
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
3.378W
3.571W
TEMPERATURE
θ
JA
25
150
QFN24
=37°C/W
AMBIENT TEMPERATURE (°C)
50
V
OUT
10ns/DIV
θ
JA
QFN32
A, B, C
75
=35°C/W
85
100
125
September 8, 2005
IN
V
= 1V
IN
=1V
150
FN7456.2