BGY587B,112 NXP Semiconductors, BGY587B,112 Datasheet
BGY587B,112
Specifications of BGY587B,112
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BGY587B,112 Summary of contents
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DATA SHEET dbook, halfpage BGY587B 550 MHz gain push-pull amplifier Product specification Supersedes data of 1997 Apr 10 DISCRETE SEMICONDUCTORS M3D252 2001 Oct 22 ...
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... NXP Semiconductors 550 MHz gain push-pull amplifier FEATURES Excellent linearity Extremely low noise Silicon nitride passivation Rugged construction TiPtAu metallized crystals ensure optimal reliability. DESCRIPTION Hybrid amplifier module for CATV systems operating over a frequency range 550 MHz at a voltage supply of +24 V (DC) ...
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... NXP Semiconductors 550 MHz gain push-pull amplifier CHARACTERISTICS Table 1 Bandwidth 40 to 550 MHz; T SYMBOL PARAMETER G power gain p SL slope cable equivalent FL flatness of frequency response S input return losses 11 S output return losses 22 CTB composite triple beat X cross modulation mod CSO composite second order ...
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... NXP Semiconductors 550 MHz gain push-pull amplifier PACKAGE OUTLINE Rectangular single-ended package; aluminium flange; 2 vertical mounting holes 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads DIMENSIONS (mm are the original dimensions UNIT b c max. max. max. 0.51 mm 20.8 9.5 0.25 27.2 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...