BGY883,112 NXP Semiconductors, BGY883,112 Datasheet
BGY883,112
Specifications of BGY883,112
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BGY883,112 Summary of contents
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DATA SHEET dbook, halfpage BGY883 860 MHz gain push-pull amplifier Product specification Supersedes data of 1997 Apr 14 DISCRETE SEMICONDUCTORS M3D252 2001 Oct 31 ...
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... NXP Semiconductors 860 MHz gain push-pull amplifier FEATURES Excellent linearity Extremely low noise Silicon nitride passivation Rugged construction Gold metallization ensures excellent reliability. DESCRIPTION Hybrid amplifier module designed for CATV systems operating over a frequency range 860 MHz at a voltage supply (DC) ...
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... NXP Semiconductors 860 MHz gain push-pull amplifier CHARACTERISTICS Table 1 Bandwidth 40 to 860 MHz; V SYMBOL PARAMETER G power gain p SL slope cable equivalent FL flatness of frequency response s input return losses 11 s output return losses 22 s phase response 21 CTB composite triple beat X cross modulation mod ...
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... NXP Semiconductors 860 MHz gain push-pull amplifier PACKAGE OUTLINE Rectangular single-ended package; aluminium flange; 2 vertical mounting holes 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads DIMENSIONS (mm are the original dimensions UNIT b c max. max. max. 0.51 mm 20.8 9.5 0.25 27.2 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...