AT32UC3C164C Atmel Corporation, AT32UC3C164C Datasheet - Page 90
AT32UC3C164C
Manufacturer Part Number
AT32UC3C164C
Description
Manufacturer
Atmel Corporation
Datasheets
1.AT32UC3A0128.pdf
(377 pages)
2.AT32UC3A0128.pdf
(159 pages)
3.AT32UC3C0128C.pdf
(1313 pages)
4.AT32UC3C0128C.pdf
(108 pages)
Specifications of AT32UC3C164C
Flash (kbytes)
64 Kbytes
Pin Count
100
Max. Operating Frequency
66 MHz
Cpu
32-bit AVR
Hardware Qtouch Acquisition
No
Max I/o Pins
81
Ext Interrupts
100
Usb Transceiver
1
Quadrature Decoder Channels
2
Usb Speed
Full Speed
Usb Interface
Device + OTG
Spi
7
Twi (i2c)
3
Uart
5
Can
2
Lin
5
Ssc
1
Ethernet
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
16
Adc Resolution (bits)
12
Adc Speed (ksps)
2000
Analog Comparators
4
Resistive Touch Screen
No
Dac Channels
4
Dac Resolution (bits)
12
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
20
Self Program Memory
YES
Dram Memory
No
Nand Interface
No
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
3.0 to 3.6 or 4.5 to 5.5
Operating Voltage (vcc)
3.0 to 3.6 or 4.5 to 5.5
Fpu
Yes
Mpu / Mmu
Yes / No
Timers
6
Output Compare Channels
22
Input Capture Channels
12
Pwm Channels
19
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT32UC3C164C-AUR
Manufacturer:
ATMEL
Quantity:
1 240
8. Mechanical Characteristics
8.1
8.1.1
8.1.2
32117CS–AVR-08/11
Thermal Considerations
Thermal Data
Junction Temperature
Table 8-1
Table 8-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
JA
JC
90.
Table 8-1 on page
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
=
summarizes the thermal resistance data depending on the package.
T
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
90.
θ
HEATSINK
JA
)
51.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
No air flow
No air flow
No air flow
No air flow
TQFP100
TQFP100
LQFP144
LQFP144
Package
TQFP64
TQFP64
QFN64
QFN64
AT32UC3C
Table 8-1 on page
20.0
40.5
39.3
38.1
Typ
0.8
8.7
8.5
8.4
”Power
J
°C/W
°C/W
°C/W
°C/W
in °C.
Unit
90