SAM9XE256 Atmel Corporation, SAM9XE256 Datasheet - Page 256

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SAM9XE256

Manufacturer Part Number
SAM9XE256
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9XE256

Flash (kbytes)
256 Kbytes
Pin Count
217
Max. Operating Frequency
180 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
6
Ssc
1
Ethernet
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
Yes
Adc Channels
4
Adc Resolution (bits)
10
Adc Speed (ksps)
312
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
32
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.65 to 1.95
Fpu
No
Mpu / Mmu
No / Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
32khz Rtc
Yes
Calibrated Rc Oscillator
No
24.6.4
Register Name:
Address:
Access Type:
Reset Value:
• LPCB: Low-power Configuration Bits
• PASR: Partial Array Self-refresh (only for low-power SDRAM)
PASR parameter is transmitted to the SDRAM during initialization to specify whether only one quarter, one half or all banks
of the SDRAM array are enabled. Disabled banks are not refreshed in self-refresh mode. This parameter must be set
according to the SDRAM device specification.
• TCSR: Temperature Compensated Self-Refresh (only for low-power SDRAM)
TCSR parameter is transmitted to the SDRAM during initialization to set the refresh interval during self-refresh mode
depending on the temperature of the low-power SDRAM. This parameter must be set according to the SDRAM device
specification.
• DS: Drive Strength (only for low-power SDRAM)
DS parameter is transmitted to the SDRAM during initialization to select the SDRAM strength of data output. This parame-
ter must be set according to the SDRAM device specification.
6254C–ATARM–22-Jan-10
00
01
10
11
31
23
15
7
SDRAMC Low Power Register
Low Power Feature is inhibited: no Power-down, Self-refresh or Deep Power-down command is issued to
the SDRAM device.
The SDRAM Controller issues a Self-refresh command to the SDRAM device, the SDCLK clock is
deactivated and the SDCKE signal is set low. The SDRAM device leaves the Self Refresh Mode when
accessed and enters it after the access.
The SDRAM Controller issues a Power-down Command to the SDRAM device after each access, the
SDCKE signal is set to low. The SDRAM device leaves the Power-down Mode when accessed and
enters it after the access.
The SDRAM Controller issues a Deep Power-down command to the SDRAM device. This mode is
unique to low-power SDRAM.
30
22
14
SDRAMC_LPR
0xFFFFEA10
Read-write
0x0
6
PASR
29
21
13
5
TIMEOUT
AT91SAM9XE128/256/512 Preliminary
28
20
12
4
27
19
11
3
DS
26
18
10
2
25
17
9
1
TCSR
LPCB
24
16
8
0
256

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