1-1926730-8 TE Connectivity, 1-1926730-8 Datasheet - Page 3

• Manufacturer Part Number: 1-1926730-8
• Manufacturer: TE Connectivity

Specifications of 1-1926730-8

• Pcb Mount Alignment: With
• Pcb Mount Retention: With
• Pcb Mounting Orientation: Right Angle
• Make First / Break Last: Yes
• Product Line: MINIPAK HDL
• Ul File Number: E28476
• Termination Method To Pc Board: Through Hole - Press Fit
• Pcb Mount Alignment Type: Boardlocks
• Sealed: No
• Number Of Power Positions: 8
• Operating Voltage Reference: AC
• Operating Voltage (vac): 250
• Hot Pluggable: No
• Tail Length (mm [in]): 3.3 [0.13]
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 8.00 [0.315]
• Number Of Signal Positions: 25
• Number Of Positions: 33
• Pcb Mount Retention Type: Boardlock(s)
• Selectively Loaded: Yes
• Centerline (mm [in]): 2.00 [0.079]
• Centerline, Power Contacts (mm [in]): 2.75 [0.108]
• Underplate Material Thickness (µm [?in]): 1.27 [50.000]
• Length (x-axis) (mm [in]): 46.21 [1.820]
• Width (z-axis) (mm [in]): 26.50 [1.040]
• Number Of Rows: 1
• Mating Retention: Without
• Tail Plating Material: Matte Tin
• Contact Type: Pin
• Contact Base Material: Copper
• Contact Plating, Mating Area, Material: Gold or Palladium Nickel or Performance Based
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.762 [30]
• Tail Plating, Thickness (µm [?in]): 0.5 [20]
• Underplate Material: Nickel
• Contact Design: Single Beam
• Connector Style: Plug
• Mating Alignment: With
• Housing Material: Crystal Polymer
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Mating Alignment Type: Passive Guide
• Connector Contact Configuration (no. Of Pos./type): 25/Signal, 8/AC Power
• Custom Configurable: No
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Agency/standard: UL, CSA
• Ul Rating: Recognized
• Ul Voltage Rating (vac): 250
• Csa Certified: Yes
• Operating Temperature (°c [°f]): -40 – +125 [-40 – +257]
• Pcb Thickness, Recommended (mm [in]): 1.40 [0.055]
• Applies To: Printed Circuit Board
• Board-to-board Configuration: Co-Planar
• Contact Transmits (typical Application): Signal (Data)/ Power
• Application Use: Board-to-Board
• Pick And Place Cover: Without
• Packaging Method: Tube

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3.5.
Initial exam ination of product.
Final examination of product.
Low Level Contact Resistance
(LLCR), signal and power contacts.
Contact resistance at rated current,
power contacts.
Insulation resistance.
W ithstanding voltage.
Rev B
Test Requirem ents and Procedures Sum m ary
Test Description
Meets requirem ents of product
drawing.
Meets visual requirem ents.
Power contacts:
5 m illiohm s m axim um initial.
5 m illiohm s m axim um change.
Signal contacts:
20 m illiohm s m axim um initial.
10 m illiohm s m axim um change.
1.6 m illiohm s average of the
m axim um values, end of life.
1000 m egohm s m inim um for both
signal and power contacts.
One m inute hold with no breakdown
or flashover.
Figure 3 (continued)
ELECTRICAL
Requirem ent
EIA-364-18.
Visual and dim ensional (C of C)
inspection per product drawing.
Docum ent gold plating thickness at
contact interfaces.
EIA-364-18.
Visual inspection.
EIA-364-23.
Subject specim ens to 100
m illiam peres m axim um and 20
m illivolts m axim um open circuit
voltage.
EIA-364-6.
Measure m illivolt drop at
17 am peres at 30 C tem perature
rise end of life for 2.75 m m
centerline, 8 contacts energized.
See Figure 2.
EIA-364-21.
100 volts DC, 2 m inute hold for
signal contacts.
500 volts DC, 2 m inute hold for
power contacts.
Test between adjacent contacts of
m ated specim ens.
EIA-364-20, Condition I.
750 volts DC at sea level for signal
contacts.
2500 volts DC for power contacts.
Test between adjacent contacts of
m ated specim ens and between
closest signal and power contacts.
Procedure
108-2325
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