EL8108IS Intersil, EL8108IS Datasheet - Page 10

• Manufacturer Part Number: EL8108IS
• Description: IC AMP VIDEO DISTRIBUTION 8-SOIC
• Manufacturer: Intersil

Specifications of EL8108IS

• Applications: Current Feedback
• Number Of Circuits: 2
• -3db Bandwidth: 200MHz
• Slew Rate: 800 V/µs
• Current - Supply: 14.3mA
• Current - Output / Channel: 450mA
• Voltage - Supply, Single/dual (±): 5 V ~ 12 V, ±2.5 V ~ 6 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Typical Performance Curves
Applications Information
Product Description
The EL8108 is a dual current feedback operational amplifier
designed for video distribution solutions. It is a dual current
mode feedback amplifier with low distortion while drawing
moderately low supply current. It is built using Intersil’s
proprietary complimentary bipolar process and is offered in
industry standard pinouts. Due to the current feedback
architecture, the EL8108 closed-loop 3dB bandwidth is
dependent on the value of the feedback resistor. First the
desired bandwidth is selected by choosing the feedback
resistor, R
resistor, R
Performance Curves” on page 4 show the effect of varying
both R
dependent on the power supply voltage.
FIGURE 36. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 38. PACKAGE POWER DISSIPATION vs AMBIENT
F
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
and R
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY (4-LAYER) TEST BOARD
F
G
0
, and then the gain is set by picking the gain
1.136W
0
. The curves at the beginning of the “Typical
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - LPP EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
TEMPERATURE
3.125W
TEMPERATURE
G
. The 3dB bandwidth is somewhat
25
25
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
50
50
10
θ
75 85
JA
75
QFN16
= +40°C/W
85
100
100
(Continued)
125
125
150
150
EL8108
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended. Lead lengths
should be as short as possible, below ¼”. The power supply
pins must be well bypassed to reduce the risk of oscillation.
A 4.7µF tantalum capacitor in parallel with a 0.1µF ceramic
capacitor is adequate for each supply pin.
For good AC performance, parasitic capacitances should be
kept to a minimum, especially at the inverting input. This
implies keeping the ground plane away from this pin. Carbon
resistors are acceptable, while use of wire-wound resistors
should not be used because of their parasitic inductance.
Similarly, capacitors should be low inductance for best
performance.
FIGURE 37. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 39. PACKAGE POWER DISSIPATION vs AMBIENT
1.4
1.2
1.0
0.8
0.6
0.4
0.2
1.2
1.0
0.8
0.6
0.4
0.2
0
0
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
781mW
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
TEMPERATURE
TEMPERATURE
833mW
25
25
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
50
50
θ
JA
75
75
= +150°C/W
QFN16
85
85
100
100
125
125
January 29, 2008
150
150
FN7417.2