AD7658 Analog Devices, AD7658 Datasheet - Page 10
![no-image](/images/manufacturer_photos/0/0/56/analog_devices_sml.jpg)
AD7658
Manufacturer Part Number
AD7658
Description
250 kSPS, 6-Channel,SimultaneousSampling, Bipolar 12-Bit A/D Converter
Manufacturer
Analog Devices
Datasheet
1.AD7656.pdf
(32 pages)
Specifications of AD7658
Resolution (bits)
12bit
# Chan
6
Sample Rate
250kSPS
Interface
Par,Ser,SPI
Analog Input Type
SE-Bip
Ain Range
Bip (Vref) x 2,Bip (Vref) x 4,Bip 10V,Bip 5.0V
Adc Architecture
SAR
Pkg Type
QFP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD7658BSTZ
Manufacturer:
ADI
Quantity:
329
Company:
Part Number:
AD7658BSTZ
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Part Number:
AD7658BSTZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
AD7658BSTZ-1
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Company:
Part Number:
AD7658BSTZ-1-RL
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Company:
Part Number:
AD7658BSTZ-REEL
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Company:
Part Number:
AD7658YSTZ
Manufacturer:
Analog Devices Inc
Quantity:
10 000
AD7656/AD7657/AD7658
ABSOLUTE MAXIMUM RATINGS
T
Table 5.
Parameter
V
V
V
AV
DV
DV
AGND to DGND
V
Analog Input Voltage to AGND
Digital Input Voltage to DGND
Digital Output Voltage to GND
REFIN to AGND
Input Current to Any Pin Except
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Pb/SN Temperature, Soldering
Pb-Free Temperature, Soldering Reflow
1
2
circuitry, a 240 Ω series resistor should be placed on the analog inputs.
If the analog inputs are being driven from alternative V
Transient currents of up to 100 mA do not cause SCR latch-up.
DD
SS
DD
DRIVE
A
Supplies
B Version
Y Version
Reflow (10 sec to 30 sec)
CC
CC
CC
= 25°C, unless otherwise noted.
to AGND, DGND
to AGND, DGND
to AV
to AGND, DGND
to AV
to DGND, AGND
to DGND
CC
CC
2
1
Rating
−0.3 V to +16.5 V
+0.3 V to −16.5 V
AV
−0.3 V to +7 V
−0.3 V to AV
−0.3 V to +7 V
−0.3 V to +0.3 V
−0.3 V to DV
V
−0.3 V to V
−0.3 V to V
−0.3 V to AV
±10 mA
−40°C to +85°C
−40°C to +125°C
−65°C to +150°C
150°C
240(+0)°C
260(+0)°C
SS
CC
− 0.3 V to V
DD
− 0.3 V to 16.5 V
and V
DRIVE
DRIVE
SS
CC
CC
CC
supply
DD
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
Rev. C | Page 10 of 32
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages. These
specifications apply to a four-layer board.
Table 6. Thermal Resistance
Package Type
64-Lead LQFP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
45
JA
θ
11
JC
Unit
°C/W