ADP1650 Analog Devices, ADP1650 Datasheet - Page 29

• Manufacturer Part Number: ADP1650
• Description: 1.5 A LED Flash Driver with I2C-Compatible Interface
• Manufacturer: Analog Devices

Specifications of ADP1650

• Product Description: 1.5 A LED Flash Driver with I2C-Compatible Interface
• Led #: 1
• Led Configuration: Serial
• Topology: Inductive
• Application: Flash
• I2c Support: Yes
• Max Iout (ma): 1500mA
• Brightness Control: I2C
• Peak Efficiency (%): 90%
• Switching Frequency: 3MHz
• Over Volt Protection (v): 5.5V
• Vin Min (v): 2.7V
• Vout (v): 4.575 to 5.425
• Synchronous: Yes
• Package: 12-Bump WLCSP

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADP1650ACBZ-R7
ADP1650ACPZ-R7
ADP1650CB-EVALZ
ADP1650CP-EVALZ
1
2
Z = RoHS Compliant Part.
This package option is halide free.
1
IDENTIFIER
BALL A1
Temperature Range
−40°C to +125°C
−40°C to +125°C
(BALL SIDE DOWN)
PIN 1 INDEX
TOP VIEW
SEATING
PLANE
1.54
1.50
1.46
AREA
0.80
0.75
0.70
Figure 48. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]
Figure 47. 12-Ball Wafer Level Chip Scale Package [WLCSP]
2.04
2.00
1.96
TOP VIEW
0.30
0.25
0.20
3.10
3.00 SQ
2.90
Package Description
12-Ball Wafer Level Chip Scale Package [WLCSP]
10-Lead Frame Chip Scale Package [LFCSP_WD]
Evaluation Board WLCSP Package
Evaluation Board LFCSP Package
3 mm × 3 mm Body, Very Very Thin, Dual Lead
0.022
Dimensions shown in millimeters
Dimensions shown in millimeters
0.380
0.352
0.324
REF
Rev. C | Page 29 of 32
0.20 REF
(CB-12-4)
(CP-10-9)
0.05 MAX
0.02 NOM
0.50
0.40
0.30
0.660
0.602
0.544
0.04 MAX
COPLANARITY
0.280
0.250
0.220
SEATING
PLANE
0.330
0.310
0.290
5
6
BOTTOM VIEW
2.48
2.38
2.23
EXPOSED
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PAD
1.50
REF
REF
0.50
10
1
0.50 BSC
1.00
REF
1.74
1.64
1.49
3
(BALL SIDE UP)
Package Option
CB-12-4
CP-10-9
BOTTOM VIEW
2
1
A
B
C
D
2
ADP1650
Branding
LE4
LGX